Automatic Die Attach Operator

About the Company

MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across diverse end markets, including Data Centers, Telecommunications, Industrial and Aerospace and Defense. We develop innovative, cutting-edge technologies and products across the spectrum of radio frequency (RF), microwave, millimeter wave, photonics and high-speed analog technologies. Our solutions support critical network infrastructure applications like artificial intelligence, high performance computing, satellite communications, radar, unmanned aerial vehicles, medical equipment, test and measurement and advanced wireless networks.

MACOM has more than 75 years of expertise in semiconductor process development, wafer fabrication, circuit design, advanced packaging, systems architecture and applications engineering. We partner with customers to solve their most challenging problems by providing semiconductor solutions at the forefront of the highest power, highest frequency and/or highest data rates.

About the Role

This role is an assembly operator working with Automatic die attach equipment.

Responsibilities

• Works under direction and from production schedules, manufacturing procedures, process plans and written or oral instruction.
• Operate and set-up Automatic epoxy dispensing die attach machines (Datacon 2200 systems) per micro-circuit layout drawing.
• Work to microcircuit layout drawings; responsible for proper conductive epoxy dispense and die placement.
• Flexibility to be trained in multiple Microelectronics processes that involve die attaching.
• Requires significant attention to detail for production activities and documentation to maintain compliance with Mil Standard 883 requirements.

Requirements

• Ability to set-up, operate and adjust (Plaomar 8000 or H+K 820 systems) or ability to learn to run a variety of microelectronic production equipment.
• Minimum of 2 years' experience in microelectronics module assembly area.
• High School diploma required.
• Due to ITAR regulations, only candidates who are U.S. Persons (U.S. citizens, U.S. nationals, lawful permanent residents, or individuals granted asylum or refugee status) will be considered for this position.

Skills

• Wire-bonding one Mil gold (Au) wire to a variety of dice and substrates.

Work Environment

Clean-room environment with smocks and gloves.

Benefits

• Health, dental, and vision insurance.
• Employer-sponsored 401(k) plan.
• Paid time off.
• Professional development opportunities.