ATD MIHL Equipment Development Engineer

About the role

Join Intel's Packaging Module Development team and play a critical role in shaping the future of assembly packaging technologies. As a Packaging Module Development Engineer, you will design and optimize innovative processes and equipment to support Intel's roadmap for next-generation packaging solutions. Your work will directly impact manufacturing efficiency, product reliability, and technological advancements, ensuring Intel maintains its position as a global leader in the semiconductor industry.

Responsibilities

• Develop and refine packaging processes and equipment to achieve quality, reliability, cost, yield, productivity, and manufacturability targets.
• Apply Design of Experiments (DOE) principles and statistical methodologies to optimize processes and specifications, documenting findings through technical reports.
• Design and maintain equipment to evaluate packaging technologies under simulated field conditions, such as heat, humidity, temperature cycles, and dynamic forces.
• Ensure manufacturability of physical layouts in package design and oversee the lifecycle of manufacturing workflows.
• Define material specifications and collaborate with supplier quality and procurement teams to ensure compliance with quality and performance benchmarks.
• Innovate new techniques, tools, and quality screens to proactively identify and mitigate packaging reliability challenges.
• Set reliability benchmarks based on a thorough understanding of failure mechanisms to meet customer needs.
• Lead problem-solving initiatives and drive continuous improvement in equipment and processes.
• Provide expert consultation to internal teams and partners on packaging challenges and technical solutions.
• Standardize product qualification practices and manufacturing quality systems while managing technical risks aligned with product milestones.

Requirements

• Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Qualifications listed would be obtained through a combination of industry relevant job experience, internship experiences and/or schoolwork/classes/research.
• Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 3+ years of relevant experience.
• –OR– Master's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 2+ years of relevant experience.
• –OR– PhD in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 6+ months of relevant experience.

Qualifications

• Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
• Familiarity with mechanical drawings and Geometric Dimensioning and Tolerancing.
• Competency in mechanical design software such as SolidWorks or AutoCAD.

Preferred Qualifications

• Proven ability to lead technical innovation and manage complex, time-sensitive projects.
• Understanding of semiconductor fabrication processes and packaging technologies.
• Familiarity with supply chain management in a manufacturing or materials qualification environment.
• Experience with high-precision manufacturing methods, including stamping and CNC machining.

Benefits

• Competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.

Pay

Annual Salary Range for jobs which could be performed in the US: $115,110.00 – $188,890.00 USD. The range displayed reflects the minimum and maximum target compensation across all US locations. Individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.