Assembler 3

About the Role

Northrop Grumman Mission Systems sector is seeking an Assembler 3 to join our team in Buffalo, New York. The qualified applicant will work at Amherst Systems, an organization focused on development and production of state-of-the-art Simulation Systems solutions and focused assembly cells supporting other Northrop Grumman operations and products.

Travel is required, up to 10% of the time. No clearance or relocation assistance is available for this role.

Responsibilities

• Assemble electronic components using assembly drawings, diagrams, and job aids to meet customer requirements.
• Perform processes including but not limited to:
  • Fine-pitch soldering of circuit card assemblies
  • BGA rework and repair of circuit cards
  • Manual and automated assembly of microelectronics
  • Electromechanical assembly
  • Semi-rigid wire and cable harness fabrication and installation
  • Winding and encapsulation of transformers
• Perform all assembly work in accordance with industry and company standards.
• Perform continuity checks on in-process and completed work.
• Operate basic production equipment (e.g., soldering stations, crimp tools, microscopes, ovens) in a safe and controlled manner.
• Inspect work for workmanship and compliance to released build documentation; identify and help resolve nonconformances, including performing rework and repair.
• Record production data accurately in travelers, shop floor systems, and quality records.
• Collaborate with technicians, engineers, and supervisors to clarify build instructions and suggest improvements to processes and tooling.
• Follow all safety, ESD, FOD, and cleanliness guidelines to maintain a safe and compliant work area.
• Successfully complete in-house workmanship criteria training classes for continued employment.

Requirements

• 4 years of assembly or electronic experience; or an associate degree in an electronic or technical discipline.
• Experience soldering at a Class 2 level.
• Experience working tasks from written directions and drawings.
• Ability to flex between job responsibilities based on business demand.
• Experience working in a manufacturing environment.
• Ability to move objects weighing up to 40 pounds from one location to another.
• Basic computer skills including experience with Microsoft Word, Excel, and Outlook.
• U.S. citizenship.

Preferred Qualifications

• Previous or current certifications in IPC-610 and/or J-STD 001.
• Ability to perform tasks under a microscope on very small assemblies with outstanding manual dexterity and precision.
• Prior microelectronics and/or chip and wire assembly experience.
• Prior automated equipment skills such as Surface Mount Technology (SMT), automated MRSI component placement, and/or wedge bonding equipment.
• Ability to learn and perform tasks independent of continuous guidance, assistance, and supervision.
• Demonstrated success in working in a team environment and strong interpersonal skills.
• Ability to provide positive customer service interaction and perform assembly tasks while traveling to customer sites.
• Ability to perform tasks requiring semi-rigid cables and building assemblies which require semi-rigid wiring.
• Willingness to travel.
• Willing to work second shift if necessary.

Benefits

• 9/80 work schedule – every other Friday off.
• Clean, modern facility – bright, tidy, and organized.
• Health insurance, 401(k) match, and paid time off (including end-of-year shutdown).
• Employee Networks and regular on-site and off-site employee events.
• Education assistance and training and development opportunities.

Pay

Primary level salary range: $46,700.00 - $77,900.00. Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results.