ASIC Engineer

About the role

We are seeking an IC Package Design Manager to lead a team of engineers in designing complex flip-chip-BGA packages for industry-leading ASICs. These ASICs are vital for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. As part of a global R&D team, you will develop high-performance package designs featuring high-speed SerDes, 5G RF/Microwave ADC/DAC, HBM, DDR5, and more.

Responsibilities

• Lead and manage a team of 6-10 engineers, with potential for team growth.
• Design complex flip-chip-BGA packages for ASICs with high-speed SerDes and high-power delivery needs.
• Support the worldwide R&D team in developing high-performance package designs.
• Contribute to the development of technical methodologies and project management.
• Manage team and customer activities to ensure projects stay on track.
• Create and track project plans for over 20 concurrent designs, managing scope, schedules, and resources.
• Communicate plans, status updates, next steps, and risks effectively.
• Steer package technology and design rules with input from team members.
• Collaborate with customers, vendors, and cross-functional teams.

Requirements

• 12+ years of experience in flip-chip-BGA package design, including high-speed SerDes.
• Minimum of 3 years in a management role.
• Bachelor's or Master's degree in Electrical Engineering or a similar field.
• Knowledge of package-level signal and power integrity.
• Self-management and organizational skills.
• Technical understanding of the package-design lifecycle, including .mcm, package spreadsheets, and drawings.

Skills

• Experience with layout, SI/PI extractions, and simulations.
• Automation code development skills.
• Mechanical and thermal modeling expertise.
• Proficiency in project management.
• Ability to understand skill sets and traits of team members to maximize productivity and retention.
• Experience with new business quotes, power integrity, and PCB layout.

Work Environment

This role requires working onsite five days a week, split between San Jose and Fort Collins locations. The work environment supports collaboration with a worldwide team across multiple time zones, requiring co-design with internal team members and external designers.

Pay

The pay range for this position is $140,000.00 - $240,000/yr. Individual compensation offered for this position within this range will depend on many factors, including qualifications, skills, relevant experience, job knowledge, geographic location, internal equity, and other pertinent job-related factors.

Benefits

• Discretionary annual bonus.
• New hire equity grant and annual equity awards.
• Medical, dental, and vision plans.
• 401(K) participation including company matching.
• Employee Stock Purchase Program (ESPP).
• Employee Assistance Program (EAP).
• Company paid holidays, paid sick leave, and vacation time.
• Paid Family Leave and other leaves of absence in accordance with applicable laws.

Schedule

This is a permanent, fully onsite position in Fort Collins, CO.