Applications Technologist

Your key responsibilities

• Set up and run CMP polishing tools (benchtop CETR polisher or floor-standing CTS single-platen polisher) to execute R&D projects.
• Use specialized measurement tools (e.g., AFM, SEM, film thickness tools) to check wafers for scratches, particles, and surface uniformity.
• Monitor parameters using Statistical Process Control (SPC) to optimize slurry flow rate, rotation speed, and downforce pressure.
• Troubleshoot first-level mechanical issues, adjust consumables (pads, conditioning disks), and participate in preventive maintenance.

Requirements

• Minimum B.S. in chemistry, chemical engineering, mechanical engineering, materials science/eng, or related field with 3+ years of related experiences.
• Understanding of semiconductor fabrication and fab metrology & procedures preferred.
• Demonstrated highly effective communication skills.