Advanced ASIC Physical Design Lead (Teradyne, North Reading, MA)
Teradyne · North Reading, MA · 4 mo ago
Engineering$192k–$308k/yrFull-time
About the role
We are seeking an experienced Physical Design Lead to join our Silicon Technology Engineering (STE) organization within the Digital ASIC Group. This team develops advanced-node, large-scale mixed-signal ASICs that are foundational to Teradyne’s next-generation SoC and memory test platforms.
Responsibilities
- Lead and mentor a team of physical design engineers across the full project lifecycle
- Lead high-level physical design planning and define PD architecture in collaboration with chip and system architects
- Develop and own chip floorplans, timing budgets, power estimates, and pin planning
- Partner with design teams to develop high-quality SDC constraints
- Drive RTL-to-netlist activities including synthesis, logical equivalence checking (LEC), clock domain crossing checks (CDC), and static timing analysis (STA)
- Support hands-on place-and-route (P&R) for critical and high-speed blocks
- Collaborate with a backend physical design house to support P&R execution, debug flow or implementation issues, and meet schedule and quality goals
- Integrate complex IP such as PCIe, DDR5/DDR6, UFS, and SerDes
- Ensure robust signoff closure including DRC/LVS and EM/IR analysis
- Develop, enhance, and maintain physical design tool flows and automation
Requirements
- 10+ years of hands-on ASIC physical design experience, including leadership of large or complex PD projects
- Proven experience at advanced technology nodes (16nm and below)
- Deep expertise in RTL-to-GDSII flows and timing closure
- Strong understanding of STA, constraints development, and signoff methodologies
- Experience integrating high-speed and complex IP (e.g., PCIe, DDR5/DDR6, UFS, SerDes)
- Proficiency with industry-standard EDA tools (Cadence preferred)
- Strong scripting and automation skills using Tcl, Python, and/or Make
- Ability to lead technically, communicate clearly, and collaborate across disciplines
- BS or MS in Electrical Engineering (or equivalent practical experience)
Qualifications
- BS or MS in Electrical Engineering (or equivalent practical experience)
Skills
- Hands-on ASIC physical design experience
- Advanced technology node experience (16nm and below)
- RTL-to-GDSII flows and timing closure expertise
- STA, constraints development, and signoff methodologies knowledge
- High-speed and complex IP integration experience
- Industry-standard EDA tools proficiency (Cadence preferred)
- Tcl, Python, and/or Make scripting and automation skills
- Technical leadership and mentoring abilities
Benefits
- Competitive compensation, benefits, and career growth opportunities
- Work on cutting-edge silicon that directly impacts the semiconductor ecosystem
- High technical ownership and visibility
- Collaborative, engineering-driven culture
Pay
The base salary range for this role is $192,300 to $307,600. This range is a good faith estimate, and the amount of base salary will correspond with experience and skill set. This range can also fluctuate depending on demand and location.
Schedule
N/A