3D-IC Application Engineer

About the role

As an Applications Engineer with Siemens EDA Technology Solutions Sales, you will support consultative sales efforts at the world’s leading semiconductor and electronic equipment manufacturers. Your primary responsibility is to secure technical design wins for Siemens EDA's product and service offerings, including Innovator 3D IC Layout, Innovator3D IC Integrator, Xpedition, Calibre, HyperLynx, and other product families. You will deliver technical presentations, conduct product demonstrations and benchmarks, and participate in the development of solutions and account strategies to drive market share gains. This position will also help architect and prototype Siemens EDA’s emerging 3DIC solution by developing flows and integration scripts to link tools into a cohesive solution. Your territory covers key accounts across the US, and you will collaborate with peers globally while communicating essential status to stakeholders and influential customers. International travel may be required.

Responsibilities

• Secure technical design wins for Siemens EDA’s product and service offerings.
• Deliver technical presentations and conduct product demonstrations and benchmarks.
• Participate in the development of solutions and account strategies to drive market share gains.
• Architect and prototype Siemens EDA’s emerging 3DIC solution through the development of flows and integration scripts.
• Integrate with peers located globally and communicate essential status to stakeholders and influential customers.

Qualifications

• MSEE/BSEE with 4+ years of design experience.
• Significant experience in advanced IC Package layout design and/or interposer layout design.
• Experience with IC design is a plus.

Technical Skills

• Knowledge of IC Package Design (Cadence APD/SiP, Siemens Xpedition/i3DL) is required.
• Practical experience with Package design tools from design setup (stackup/constraints/etc), to implementation (routing/outgassing/re-use/etc), through generation of manufacturing documents is required.
• Familiarity with Package / Interposer planning solutions (Siemens XSI/i3DI, Cadence OrbitIO/ISP, Synopsys 3DIC Compiler, Excel) is preferred.
• Familiarity with 2.5D and 3D chiplet-based design solutions (TSMC InFO, CoWoS, Intel EMIB, Foveros, ASE FoCUS, Amkor SWIFT, Samsung I/H/X-Cube, etc.) is preferred.
• Knowledge of IC data formats (Verilog, LEF/DEF, GDS, OASIS, etc.) is desired.
• Familiarity with signal/power integrity tools (HyperLynx, Sigrity, SIWave, ADS, etc.) and analysis flows is preferred.
• Experience with Siemens Calibre DRC, LVS, and/or 3DSTACK solutions is highly desirable.
• Above average competency with Microsoft Word, Excel, and PowerPoint.
• Scripting/Programming: VBS, Python, Tcl, Perl, or similar languages.
• Working OS knowledge of Windows and Linux.
• Prior experience as an Applications Engineer is preferred.

Ideal Candidate

• Possesses a passion to learn and perform at the cutting edge of technology.
• Has a desire to broaden exposure to the business aspects of the technical design world.
• Enjoys contributing to the success of a great team.
• Is able to work independently with minimal supervision.
• Effectively influences people at any level.
• Enjoys helping and motivating others to be successful.
• Demonstrates the ability to build strong rapport and credibility with customer organizations while maintaining a company internal network of contacts.
• Is willing to travel domestically and internationally.