3D-IC Application Engineer

About the role

Support consultative sales efforts at the world’s leading semiconductor and electronic equipment manufacturers. Secure technical design wins for Siemens EDA's product and service offerings, including Innovator 3D IC Layout, Innovator3D IC Integrator, Xpedition, Calibre, HyperLynx, and other product families.

Responsibilities include delivering technical presentations, conducting product demonstrations and benchmarks, and participating in the development of solutions and account strategies to gain market share. Help architect and prototype Siemens EDA’s emerging 3DIC solution by developing flows and integration scripts to link tools into a cohesive solution.

Territory coverage includes Key Accounts throughout the US. Collaborate with global peers, communicate status to stakeholders and influential customers, and travel internationally as required.

Responsibilities

• Secure technical design wins for Siemens EDA’s product and service offerings.
• Deliver technical presentations and conduct product demonstrations and benchmarks.
• Develop solutions and account strategies to drive market share gains.
• Architect and prototype Siemens EDA’s emerging 3DIC solution by creating flows and integration scripts.
• Integrate with global peers and communicate status to stakeholders and customers.
• Travel domestically and internationally as needed.

Qualifications

• MSEE/BSEE with 4+ years of design experience.
• Significant experience in advanced IC Package layout design and/or interposer layout design.
• IC design experience is a plus.

Skills

• Knowledge of IC Package Design (Cadence APD/SiP, Siemens Xpedition/i3DL) is required.
• Practical experience with Package design tools from design setup (stackup/constraints/etc) to implementation (routing/outgassing/re-use/etc) through generation of manufacturing documents.
• Familiarity with Package/Interposer planning solutions (Siemens XSI/i3DI, Cadence OrbitIO/ISP, Synopsys 3DIC Compiler, Excel) is preferred.
• Familiarity with 2.5D and 3D chiplet-based design solutions (TSMC InFO, CoWoS, Intel EMIB, Foveros, ASE FoCUS, Amkor SWIFT, Samsung I/H/X-Cube, etc.) is preferred.
• Knowledge of IC data formats (Verilog, LEF/DEF, GDS, OASIS, etc.) is desired.
• Familiarity with signal/power integrity tools (HyperLynx, Sigrity, SIWave, ADS, etc.) and analysis flows is preferred.
• Experience with Siemens Calibre DRC, LVS, and/or 3DSTACK solutions is highly desirable.
• Above-average competency with Microsoft Word, Excel, and PowerPoint.
• Scripting/Programming: VBS, Python, Tcl, Perl, or similar languages.
• Working knowledge of Windows and Linux.
• Prior experience as an Applications Engineer is preferred.

Ideal Candidate Traits

• Passion for learning and performing at the cutting edge of technology.
• Desire to broaden exposure to the business aspects of the technical design world.
• Enjoys contributing to the success of a great team.
• Able to work independently with minimal supervision.
• Effectively influences people at any level.
• Enjoys helping and motivating others to be successful.
• Demonstrated ability to build strong rapport and credibility with customer organizations while maintaining an internal network of contacts.
• Willingness to travel domestically and internationally.

Benefits

Flexibility to choose between working at home and the office. Great benefits and rewards as expected from a world leader in industrial software.