2027 Undergrad ASIC Package Engineering Co-op/Intern

At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future. Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading-edge products to market, every role at AMD contributes to something bigger—technology that moves the world forward.

About the role

We are seeking a highly motivated ASIC Package Engineering intern/co-op to join our team and work with our engineers in bringing new and advanced packaging technology to reality. This role requires the student to work full time (40 hours a week), in either a hybrid or onsite work structure throughout the duration of the co-op/intern term.

Locations: Austin, TX; Boxborough, MA; Fishkill, NY (summer only); Fort Collins, CO; Longmont, CO; Secaucus, NJ.

Schedule

• Spring/Summer Co-op: January 25, 2027 – August 13, 2027
• Summer Internship (Semester Schools): May 24, 2027 – August 13, 2027
• Summer Internship (Quarter Schools): June 21, 2027 – September 10, 2027
• Summer-Fall Co-op (Semester Schools): May 24, 2027 – December 10, 2027
• Summer-Fall Co-op (Quarter Schools): June 21, 2027 – December 10, 2027

Responsibilities

• Support Package Design and Package Development Engineers in prioritizing and optimizing new projects.
• Complete substrate, interposer, and bump designs for AMD products, test vehicles, and probe card substrates.
• Work on design verification implementation to ensure design performance, quality, and efficiency.
• Analyze yield and defect metrics to ensure design performance and help improve yield.
• Evaluate and benchmark packaging materials and interact with partners to achieve cost-efficient designs for optimal performance and yield.

Requirements

• Currently enrolled in a U.S.-based university in a Bachelor’s degree program majoring in Electrical Engineering, Engineering Science, Computer Engineering, Mechanical Engineering, Material Science Engineering, or a related field.
• This role is not eligible for visa sponsorship.

Skills

If you have knowledge or experience with any of the following technical skills (or related areas) and are enthusiastic about this role, we strongly encourage you to apply:

• Coursework related to transmission lines and electric circuits.
• Package, silicon, or PCB design software.
• Scripting languages: Perl, Python, or SQL.
• Semiconductor theory and packaging process/technology.
• Data analytics and data visualization tools like Power BI.

Benefits

For details on benefits offered, visit AMD benefits at a glance.