Thermal Engineer (Direct Liquid Cooling) - Houston, TX

Responsibilities

• Lead mechanical and thermal design of liquid-cooled server platforms and rack-level cooling architectures.
• Develop cooling solutions including:
  • CPU and GPU cold plates
  • Coolant manifolds
  • Tubing and hose routing systems
  • Blind-mate fluid connections
  • Quick disconnects
  • Rack coolant distribution interfaces
  • Serviceability features
• Design and integrate mechanical solutions that support high-density compute, accelerator, memory, storage, and power delivery subsystems.
• Define server and rack thermal architectures to meet performance, reliability, acoustics, power, and customer deployment requirements.
• Conduct thermal analysis using CFD, analytical calculations, and laboratory testing to optimize airflow, coolant flow, heat transfer performance, and rack thermal efficiency.
• Develop and execute qualification plans for:
  • Thermal performance
  • Leak integrity
  • Structural reliability
  • Shock and vibration
  • Material compatibility
  • Corrosion resistance
  • Manufacturing robustness
• Drive root-cause analysis and corrective actions for thermal, mechanical, and liquid cooling issues discovered during development, qualification, manufacturing, and field deployment.
• Lead technical engagements with suppliers, ODMs, and manufacturing partners to ensure successful implementation of liquid cooling hardware.
• Represent the mechanical and thermal engineering team during architecture reviews, design reviews, requirements reviews, and executive program reviews.
• Mentor junior engineers and provide technical guidance on mechanical design, thermal engineering, liquid cooling technologies, and product development processes. Project leadership and mentoring expectations.

Requirements

• Bachelor's or Master's degree in Mechanical Engineering
• Typically, 4-6 years of mechanical and thermal engineering experience.
• Experience developing server, networking, storage, AI, HPC, or data center hardware preferred.
• Experience with liquid cooling technologies and electronics thermal management strongly preferred.

Skills

• Strong foundation in:
  • Heat transfer
  • Fluid mechanics
  • Thermodynamics
  • Electronics cooling
  • Mechanical system design
• Expertise in server mechanical architecture and electronics packaging.
• Proficiency with Creo (Pro/ENGINEER) or equivalent 3D CAD tools.
• Experience using CFD and thermal modeling tools to develop