Technical Service and Applications Leader

Responsibilities

• Lead, coach, and develop a global/regional team of Technical Service / Application Engineers.
• Define clear roles, responsibilities, and performance expectations aligned with business priorities.
• Build technical depth across key domains (e.g., TIMs, Heat Spreaders, Advanced packaging, ADAS, thermal management).
• Hire, onboard, and develop capability to support growth platforms (AI datacenter, automotive).
• Foster a culture of engineer-to-engineer credibility, accountability, and structured problem solving.
• Ensure the team serves as the primary technical interface for key customers, maintaining high credibility at engineering and system levels.
• Oversee resolution of complex application, process, and reliability issues escalated from the field.
• Guide engagement in architecture definition, design reviews, and system-level discussions—not just reactive support.
• Align technical engagement strategy to prioritized accounts, programs, and projects.
• Act as the TS lead within the TS–Sales–BD triad, ensuring alignment on: Account priorities, Program milestones, Escalations and resource allocation.
• Translate technical progress into business outcomes (design wins, revenue pipeline).
• Provide structured feedback loops to R&D and Product Management on: Customer unmet needs, Product gaps and roadmap inputs.
• Build and drive operating cadence: Program reviews, Escalation processes, Knowledge sharing and best-practice replication.
• Standardize tools, methodologies, and documentation across regions.
• Optimize resource allocation across: Customers, Programs, Geographies.
• Establish a Center of Excellence (CoE) mindset for TS capabilities.
• Represent the TS function in leadership forums and strategic discussions.
• Communicate technical insights effectively to both: Deep technical audiences, Executive and commercial stakeholders.
• Mentor senior engineers into future technical or leadership roles.

Qualifications

• Required Qualifications:
• Education: Bachelor’s degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field. Advanced degree preferred.
• Experience: 10+ years in: Technical Service / Application Engineering, Semiconductor process, packaging, or materials environments. Proven experience in leading technical teams and customer-facing organizations.
• Technical Expertise: Strong exposure to OEMs, IDMs, Fabless, foundries, OSATs. Full lifecycle: architecture → design-in → qualification → HVM. Deep understanding of: Semiconductor devices, materials, and process integration, Advanced packaging (2.5D/3D, chiplets, thermal management), Ability to connect system-level requirements to material/process solutions, Strong analytical and root cause problem-solving capability.
• Leadership & Soft Skills: Strong people leadership and coaching capability, Building high impact high performing teams, Ability to operate at both strategic and execution levels, Cross-functional influence without direct authority, Excellent communication for technical and mixed audiences.