Technical Manager, Advanced Tool & Module Development (7733)
Responsibilities
- Co-Design & Joint Development: Partner deeply with key US tool suppliers to drive the engineering, architecture, and design of pre-alpha and next-generation process chambers and hardware systems.
- Hardware Innovation: Lead technical initiatives in critical sub-systems, including RF engineering, circuit design, plasma/gas delivery, chamber thermal dynamics, and mechanical modeling.
- Process Qualifications: Manage the hardware verification pipeline, identifying design flaws early in the pre-alpha phase to dramatically shorten the cycle from concept to high-volume manufacturing (HVM) readiness.
- Cross-Module Collaboration: Interface with R&D headquarter module teams to deliver robust hardware and process solutions on supplier sites.
- Technical Leadership: Act as the on-site TSMC technical expert in California, guiding supplier engineering teams to align with TSMC’s aggressive technology roadmap.
Qualifications
- Ph.D. in a relevant Engineering or Science discipline (EE, ME, Physics, Materials Science, etc.).
- A minimum of 7 years of experience (Ph.D.) in semiconductor hardware design, equipment development, or advanced process validation.
- Solid understanding of vacuum systems, gas delivery, thermal control, or precision mechanics.
- Practical knowledge of RF matching networks, plasma generation, or advanced circuit design.
- Ability to validate how hardware changes affect process performance (uniformity, defectivity, throughput) across modules like Etch, CVD/ALD, Wet, or CMP.
Preferred Qualifications
- Ph.D. with research focus on plasma-hardware interaction, RF systems, or fluid dynamics.
- Candidates with exceptional academic pedigrees and groundbreaking research in "pre-alpha" hardware systems will be considered, even if they have fewer years of industry experience.
- Strong cross-functional communication and negotiation skills to effectively collaborate with external supplier executives and internal TSMC R&D teams.
- A thriving mindset in an ambiguous, fast-paced, "pre-alpha" R&D environment.
About the Role
This newly formed team will serve as the on-site technical bridge and represent headquarter R&D teams in working shoulder-to-shoulder with US-based semiconductor equipment suppliers to shorten the hardware development cycle from prototype to process verification.
Company Description
Join TSMC Technology, Inc. (TTI), an innovation hub of Taiwan Semiconductor Manufacturing Company Limited (TSMC). TSMC has been a pioneer in the semiconductor industry since 1987. With teams located in San Jose, CA, and Austin, TX, TTI is dedicated to advancing semiconductor technology through expertise in physical design, memory design, analog mixed signal, power management, and groundbreaking computational AI machine learning research. Our mission is to drive the future of semiconductor innovation through unparalleled R&D and customer-focused IP. Be part of a team that shapes the next generation of technological advancements.
Pay & Benefits
The typical base salary range for this role is between $180,000 and $250,000 per year. The actual pay may vary based on factors such as individual skills, qualifications, education, experience, position level, and location. TSMC’s total compensation package includes market competitive pay, allowances, bonuses, and comprehensive benefits. We also offer extensive development opportunities and programs.