Technical Director

About the Role

NXP's Wireless Connectivity Modem Systems team is involved in the design, simulation, verification, and silicon bring-up of transceiver DSP architecture, RF modeling, and support for production/customer issues related to PHY layer performance for next-generation Wi-Fi and narrowband chip-sets.

Responsibilities

• Draw concepts from wireless communication theory to devise and construct experiments to test performance and identify system deficiencies with respect to physical layer metrics (e.g., packet error rate, interference rejection).
• Evaluate results, identify root-cause deficiencies, and develop design improvements.
• Develop automation tools and/or software using C/C++ or similar languages for performance evaluation, data extraction, and analysis.
• Support silicon evaluation and debug through quality assurance cycles and production.
• Conduct PHY layer algorithm design and bit-true verification with the digital design team.
• Actively participate in wireless standards development, such as IEEE 802.11 or BT-SIG.

Requirements

• M.S.E.E. with experience in the wireless communications industry.
• Understanding of Signal Processing and Digital Communications fundamentals.
• Proficiency in MATLAB and C/C++.
• Strong analytical and problem-solving skills.
• Familiarity with MIMO and OFDM technologies.

Qualifications

• Desirable: Familiarity with IEEE WLAN 802.11 standards.
• Desirable: Scripting and automation skills.
• Ability to work in a Unix/Linux environment.

Pay

The base salary range for this position in California is $225,800 to $310,500 annually. Individual total compensation may vary based on qualifications, skill level, work location, and other factors. This range does not apply to other locations.

Benefits

• Health, dental, and vision insurance.
• 401(k) plan.
• Paid leave.