TD Media and Collaterals Development Engineer

About the role

Note: This role requires regular onsite presence to fulfill essential job responsibilities. Develops media and collaterals for assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies. Optimizes and improves the efficiency of manufacturing of media and collaterals, developing improvements to meet quality, reliability, cost, yield, productivity and manufacturability requirements.

Responsibilities

• Develops media and collateral specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
• Develops and maintains equipment to evaluate media and collateral solutions under simulated field use conditions, such as heat, humidity, vibration, temperature cycle, and dynamic forces.
• Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with media and collateral quality and reliability.
• Provides consultation concerning design problems and improvements in the assembly packaging process, and responds to customer/client requests or events as they occur.
• Delivers standardization in media and collateral qualification, manufacturing prototypes, and methods and continuously engages with packaging technology development and partner engineering groups on process/technology maturity for products towards key risk areas in meeting product milestones.

Qualifications

• Possess a BS/MS/PhD degree in Mechanical Engineering/Material Engineering/Electrical Engineering/Physics related field.
• Minimum 6 months of experience in fundamental science and engineering concepts in development to create novel solutions, including strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.

Requirements

• Strong mechanical design software experience (SolidWorks, AutoCAD, etc).
• Assembly equipment, process, media, and/or collateral experience.
• Technical innovation and deliver results for complex, time critical technical projects.
• Understanding of semiconductor fabrication processes and technology with technical and analytical skills.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.

Pay

Annual Salary Range for jobs which could be performed in the US: $115,110.00 - 162,500.00 USD

Schedule

Shift 1 (United States of America)

Additional Information

Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.