Survey Technician (3D Laser Scanning)
Ayoroa | Simmons, LLC · Tysons Corner, VA · 1 mo ago
HybridManagementFull-time
Key Responsibilities
- Assist with terrestrial 3D laser scanning in diverse field environments (e.g., offices, utility spaces, and exterior campus sites).
- Support point cloud registration and processing using Leica Cyclone and NavVis Ivion (training provided as needed).
- Assist with control surveys, topographic surveys, and existing-conditions surveys using established field procedures and technologies.
- Coordinate field activities with internal teams and project stakeholders to support accuracy and schedule alignment.
- Organize project files and support QA/QC processes for scanning and registration outputs.
- Prepare scan data for integration into design platforms and documentation workflows.
- Maintain scanning/survey equipment and follow established field procedures and safety practices.
- Travel as needed to access project sites, including travel for several days at a time as required.
Qualifications
- Required: Associate degree (or in-progress) in Geomatics, Surveying, Civil Engineering Technology, Architecture, Construction Management, or a related technical field; OR equivalent technical training (trade school, military, or relevant hands-on experience).
- Demonstrated interest in laser scanning, surveying, reality capture, BIM, or related A/E/C technical workflows.
- Strong attention to detail and basic computer proficiency (file organization, transferring large datasets, following documented workflows).
- Ability to communicate clearly, follow instructions, and work collaboratively with technical teams.
- Ability to travel for several days at a time, as required by project needs.
Preferred
- Internship, coursework, or project experience with 3D laser scanning, surveying instruments, or point cloud workflows.
- Familiarity with Leica Cyclone, NavVis Ivion, Revit, and/or AutoCAD (not required).
- Manufacturer or industry training related to scanning/surveying (Leica, NavVis, Trimble, etc.).