Student (4)

Req Id: 42232 | West Lafayette, IN | Posting Start Date: 5/15/26

About the Role

The Purdue Applied Research Institute, LLC (PARI) Microelectronics Lab is seeking a Microelectronics Research Intern to support PARI applied research initiatives during the Fall 2026 and Spring 2027 semesters. This internship focuses on advancing shared program interests in advanced semiconductor packaging, heterogeneous integration, and advanced thermal cooling solutions relevant to next-generation microelectronics systems. The intern will work entirely on the Purdue University campus, engaging directly with Purdue faculty, university laboratories, and PARI subject matter experts (SMEs). The position is designed to provide meaningful, hands-on laboratory and research experience while exposing the intern to applied research at the intersection of academia and a national security mission-oriented research institute.

Responsibilities

• Support PARI research efforts in advanced thermal management and cooling solutions for microelectronic devices and systems
• Perform literature reviews and hands-on laboratory work, including experimental setup, data collection, testing, and basic analysis
• Collaborate closely with Purdue faculty and students in university laboratories
• Engage with PARI SMEs to understand applied research objectives and system-level considerations
• Assist with documentation of experimental methods, results, and technical findings
• Participate in technical discussions, research meetings, and progress reviews as appropriate to project needs
• Occasional lab work and meetings at the PARI Microelectronics Lab in Bloomington, IN

Time Commitment: 5 hours per week

Requirements

• Enrolled undergraduate student at Purdue University in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or a related STEM discipline relevant to microelectronics
• A student member of SCALE
• Completion of at least one year of academic coursework by the start of the internship
• US Citizenship is required

Qualifications

• Active interest in microelectronics research and hands-on laboratory work
• Ability to work effectively both independently and as part of a multidisciplinary research team
• Strong written and verbal communication skills
• Background or coursework in heterogeneous integration or advanced semiconductor packaging
• Exposure to thermal management or cooling technologies for electronic systems
• Familiarity with microelectronics device or system design concepts, modeling, or simulation tools
• Experience in testing and characterizing microelectronic devices using state-of-the-art equipment and measurement techniques
• Prior laboratory or research experience in an academic or applied research setting

Pay

Paid internship position