STAFF R&D/PRODUCT DVL ENGINEER

Job Overview

Data communications applications change at an exponential pace and the Data and Devices Business Unit is at the heart of a continuously expanding connected life. Accordingly, we provide responsive, iterative, and fundamentally agile capabilities to support today's demands. Our customers are building the devices and the infrastructure that is redefining what information technology means. Our products push markets and meet the ever-changing need of the evolving, more connected, data-driven world.

Job Requirements

• Technical Leadership & Customer Engagement
  Act as one of the key technical interfaces for hyperscalers, OEMs, and system architects, to gain insights into next-generation compute, AI, storage, and networking challenges.
  Identify and assess technology disruptors, translating emerging trends into strategic R&D initiatives and product development roadmaps to maintain TE’s industry leadership.
  Cultivate and strengthen customer partnerships, fostering co-development opportunities and collaborative innovation to accelerate next-gen infrastructure advancements.
  Support internal stakeholders, including product development, R&D, and sales teams, by providing technical guidance on next-gen interconnect technologie

• System-Level Architecture & Product Strategy
  Define high-level system architecture requirements, ensuring TE’s product roadmap is aligned with next-generation compute, AI, and networking ecosystems.
  Bridge the gap between customer needs and TE’s technology roadmap, ensuring TE delivers future-proof, scalable, and high-performance interconnect solutions tailored to the evolving data infrastructure landscape.
  Drive TE’s technology vision and strategy, ensuring our interconnect solutions support the evolving needs of standards like PCIe, CXL, Ethernet, InfiniBand, and the next-gen AI workloads.
  Lead the evaluation of high-speed electrical, optical, and hybrid interconnect solutions, balancing performance, power, latency, cost, and manufacturability.
  Collaborate with senior architects and internal R&D, product development, and business units to shape product development roadmaps based on real-world customer challenges and market trend

• Standards Development & Industry Influence
  Actively participate in and influence key industry standards groups (e.g., OCP, PCI-SIG, IEEE, Ethernet Alliance, CXL Consortium), ensuring TE’s strategic alignment with the future of data communication.
  Support senior architects in leading and influencing discussions on emerging protocols and interface standards, ensuring TE is at the forefront of next-generation high-speed, low-latency interconnect technologies.
  Actively contributing to the development of next-gen copper and optical interconnect standards, positioning TE as an industry innovator, ensuring our solutions stay ahead of the competition.
  Represent TE at industry forums, conferences, and standards organizations, reinforcing our role as a leader in high-speed interconnect technology and ensuring our strategic perspectives drive industry advancements.
  Develop and present thought leadership content, including technical whitepapers, reference designs, and industry presentations, to amplify TE’s influence within the standards community and the broader industry ecosystem

• Cross-Functional Leadership & Execution
  Work cross-functionally with engineering, product management, sales, and marketing teams to translate technical insights into compelling product offerings.
  Drive the execution of high-impact, innovative technical projects, ensuring seamless alignment between customer needs, business goals, and engineering capabilities.
  Guide TE’s go-to-market strategy for new interconnect solutions, ensuring that our technical differentiation is clearly communicated and leveraged in competitive landscapes.

Compensation

Competitive base salary commensurate with experience: $141,400 – $212,200 (subject to change dependent on physical location)