Staff Process Engineer, Advanced Packaging CMP

About the Role

The Staff Process Engineer in the Advanced Packaging CMP team is responsible for starting up, developing, and optimizing processes to improve product quality and reliability. This includes working on process yield improvement, cost reduction, productivity improvement, and risk management, as well as resolving manufacturing line problems. The role involves identifying, diagnosing, and resolving assembly process-related issues using failure analysis, FMEA, 8D, or SPC/FDC methodologies. Strong communication and collaboration with regional and international teams are essential, along with strict adherence to Micron’s Intellectual Property Protection policy. The role also involves extensive collaboration with vendors to develop processes that meet integration requirements.

Responsibilities

• Perform fundamental research, consumables development, and hardware evaluation, as well as test processes for novel applications.
• Initiate and manage experiments to widen process margins and evaluate manufacturability of next-generation solutions.
• Incorporate best known manufacturing methods into the early development phase of upcoming nodes.
• Design and implement advanced process monitoring and control methodologies.
• Serve in a technical advisory role, contributing to technical projects for improvements to processes, procedures, and equipment.
• Define and lead complex, multi-functional projects of critical importance to Micron, helping to define strategic direction.
• Provide advice and counsel to management on significant technical issues.
• Lead and initiate innovation projects through patents and technical papers.
• Leverage AI to improve job functions.

Requirements

• BS or MS in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, or Physics with 5+ years of experience in Chemical Mechanical Planarization (CMP) within the semiconductor industry.
• Hands-on experience with CMP equipment operation such as AMAT (LKP), EBARA-300X, optical metrology, profilometry, polishing slurries, conditioners, and polishing pads.
• Experience in dielectrics/metals CMP process development on Advanced Packaging or other semiconductor technologies.
• Understanding of various integration/structural impacts and constraints related to film deposition and other upstream/downstream processes.
• Excellent oral and written communication skills with the ability to convey messaging and technical concepts concisely and effectively.

Preferred Qualifications

• PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, or Physics plus 3+ years of relevant experience.
• Skills in data science, modeling, and experience or interest in leveraging AI to optimize workflows.
• A specialized background in 300mm wafer fabrication.

Benefits

Micron offers a comprehensive benefits package designed to support personal wellbeing and professional growth, including:

• A choice of medical, dental, and vision plans tailored to meet family healthcare needs and budget.
• Income protection programs in case of illness or injury, and paid family leave.
• A robust paid time-off program and paid holidays.

For additional information, refer to the Benefits Guide on Micron’s careers page.