Staff Foundry Interface Design Engineer- HBM - TPG
Micron Technology · Folsom, CA · Yesterday
OTHR$175k–$297k/yrFull-time
Responsibilities
- Analyze advanced foundry PDKs (FinFET and GAA) and develop design guidelines for power, performance, area, and reliability
- Provide technical support for PDK-related issues and collaborate with CAD teams, tool vendors, and foundries
- Drive design-technology co-optimization for future HBM base die architectures, including standard cells and BEOL options
- Define reliability specifications and support yield, reliability, and technology qualification efforts
- Explore and evaluate new architectures for future HBM products through detailed technical feasibility analysis
Requirements
- Bachelor’s degree in Electrical Engineering or related field with 4+ years of relevant industry experience
- Hands-on experience working with foundry technology PDKs at advanced CMOS nodes
- Experience with EDA tools, CMOS circuit design, parasitic extraction, and circuit simulation
- Solid understanding of advanced CMOS device physics, including FinFET and GAA architectures
Qualifications
- Master’s degree or higher in Electrical Engineering or a related technical field
- Experience with reliability and aging models for advanced CMOS technologies
- Strong automation and scripting skills using Python or similar languages
- Background in HBM, DRAM, or high-speed memory design and validation
Skills
Not specified
Benefits
Not specified
Pay
$175,000.00 - $297,000.00 a year
Schedule
Full-time onsite