Jobs · Engineering · California

Staff Engineer, Packaging Mechanical Simulation

Samsung Semiconductor · San Jose, CA · 2 mo ago
Engineering$163k–$253k/yrFull-time

About the role

Advancing the World’s Technology Together
Our technology solutions power the tools you use every day--including smartphones, electric vehicles, hyperscale data centers, IoT devices, and so much more. Here, you’ll have an opportunity to be part of a global leader whose innovative designs are pushing the boundaries of what’s possible and powering the future.

Responsibilities

  • Perform advanced numerical modeling and simulation to evaluate and improve the performance and reliability of cutting-edge semiconductor packages and memory devices.
  • Provide mechanical design support throughout package- and system-development stages—from concept and detailed modeling to qualification and reliability testing.
  • Apply hands-on expertise in mechanical and thermal modeling of micro-electronic components, including interconnects, solder joints, BGAs, and advanced-packaging architectures.
  • Develop and maintain scripts for process automation (Python, MATLAB, or ANSYS APDL) to streamline pre-processing, simulation, and post-processing workflows for parametric and sensitivity studies.
  • Design, execute, and interpret validation experiments that correlate and calibrate simulation models with empirical data.
  • Contribute effectively both independently and as a member of cross-functional, cross-cultural, and globally distributed teams.

Requirements

  • PhD in Mechanical Engineering, Engineering Mechanics, Materials Science, Physics, or a closely related discipline.
  • 3-5+ years of hands-on modeling and simulation experience in the high-tech or semiconductor industry.
  • Proven expertise with leading simulation tools such as ANSYS, Abaqus, HyperMesh, and their associated pre-/post-processing software.
  • Extensive experience in static and dynamic simulations, covering linear and nonlinear analyses that involve geometric and material non-linearities.
  • Adequate understanding of advanced semiconductor packaging, interconnect structures, and reliability-modeling techniques.
  • Strong technical-writing skills, capable of producing clear, comprehensive documentation and communicating complex concepts to both technical and non-technical audiences.

Qualifications

  • Inclusive, adapting your style to the situation and diverse global norms of our people.
  • An avid learner, you approach challenges with curiosity and resilience, seeking data to help build understanding.
  • Collaborative, building relationships, humbly offering support and openly welcoming approaches.
  • Innovative and creative, you proactively explore new ideas and adapt quickly to change.

Skills

  • Advanced numerical modeling and simulation.
  • Hands-on expertise in mechanical and thermal modeling.
  • Process automation using Python, MATLAB, or ANSYS APDL.
  • Validation experiments and correlation with empirical data.
  • Effective communication and collaboration with cross-functional teams.

Benefits

Base Pay Range: $163,000—$253,000 USD
We also offer incentive opportunities that reward employees based on individual and company performance. This is in addition to our diverse package of benefits centered around the wellbeing of our employees and their loved ones.

Pay

$163,000—$253,000 USD

Schedule

Daily onsite presence in San Jose HQ location in alignment with our Flexible Work policy with an average of 10% travel per month.

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