Jobs · Engineering · California

Sr. Signal Integrity Engineer – High-Speed Digital / RF

Blue Origin · San Francisco Bay Area · 2 wk ago
On-siteEngineering$213k–$299k/yrFull-time

About the role

Blue Origin is seeking a Signal Integrity (SI) Engineer to develop next-generation high-speed digital and RF systems, including advanced optical and RF interconnects. The successful candidate will lead SI analysis for high-speed serial links and RF interconnects up to ~70 GHz, using tools like HFSS, ADS, and IBIS-AMI.

Responsibilities

  • Lead SI analysis for high-speed serial links and RF interconnects up to ~70 GHz.
  • Use HFSS to model interconnects, packages, transitions, and antenna-adjacent structures.
  • Use ADS for linear/nonlinear circuit modeling, S-parameter work, and trade studies.
  • Build, adapt, and correlate IBIS-AMI models with measurements and full-wave simulations.
  • Define PCB stackups, materials, impedance targets, and routing rules for SI-robust designs.
  • Design SOLT/TRL structures, coupons, and procedures for VNA/TDR workflows.
  • Measure and correlate S-parameters, loss, isolation, and channel performance across simulation and hardware.
  • Diagnose and resolve SI issues including reflections, resonances, crosstalk, and mode conversion.
  • Produce clear reports, guidelines, and review material for cross-functional teams.

Qualifications

  • Bachelor’s degree in Electrical/Electronics Engineering or related field.
  • 5+ years in SI, high-speed digital, or RF/microwave design.
  • Proficiency with HFSS, ADS, and IBIS-AMI workflows.
  • Experience defining PCB stackups for high-speed/microwave designs.
  • Hands-on VNA/TDR measurement experience.
  • Strong understanding of transmission lines, S-parameters, loss mechanisms, jitter, crosstalk, and channel budgeting.
  • Ability to work across RF, digital, packaging, and systems teams.

Preferred Qualifications

  • Master’s degree in EE or related field.
  • Experience designing or characterizing channels/interconnects up to ~70 GHz.
  • Background in antenna-adjacent PCB design (arrays, feed networks, front-end modules).
  • Experience with package-to-PCB co-design.
  • Familiarity with scripting (Python, MATLAB) for SI automation.
  • Experience correlating BER/margin results to SI simulations.
  • Exposure to space/aerospace hardware and reliability constraints.

Additional Requirements

  • Must be a U.S. person (U.S. citizen or permanent resident) as required by applicable export control laws.
  • Willingness to support occasional off-hours testing or lab work as project schedules require.

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