Sr. SDE, MLA hardware/software co-design, Annapurna Labs Machine Learning Acceleration
Amazon Web Services (AWS) · Bee Cave, TX · 2 wk ago
ConsultingFull-time
About the role
Custom machine learning chips are at the heart of our Trainium machine learning instances, and we invite you to build them with us!
Responsibilities
- Drive the pre-silicon hardware/software co-development for our machine learning chips.
- Work with architecture, design, and emulation teams to build and test our next generation AI chips.
- Write bare-metal software and ML workloads to verify the end-to-end functionality and performance of the SoC.
Requirements
- 7+ years of ASIC implementation, synthesis, STA and physical design in deep sub-micron nodes (16nm or smaller) experience
- 7+ years of digital design in communication systems experience
- 7+ years of full-custom analog or RF layout experience
- 7+ years of wireless communications systems and implementation experience
- 8+ years of creating and maintaining automation frameworks for Post-Silicon Flow experience
- 7+ years of verification in communication systems experience
- 5+ years of UVM, C, System C, and scripting experience
- 3+ years of emulation experience
- Bachelor's degree in Electrical Engineering or a related field
- Knowledge of UVM and Matlab
- Knowledge of implementing chips with multiple power islands and power gating
- Knowledge of multiple access systems including OFDMA, TDMA, and CDMA
- Knowledge of end-to-end network system architecture from wireless physical layer to application endpoints
- Knowledge of serial protocols including SPI, I2C, I3C, and UART
- Knowledge of Python and Embedded C programming
- Experience in communication theory, OFDM, MIMO, Digital/Wireless Communication Systems or RF engineering
- Experience with current and upcoming RF standards in cellular (4G/5G), WiMAX, 802.11ad, microwave backhaul, DVB-S2 / DVB-C, or related broadband wireless standards
- Experience leading or solely developing methodology and scripts for physical synthesis
- Experience taping out chips that have gone into high volume production
- Experience developing products for volume production
- Experience low power design techniques
- Experience delivering products to volume production
- Experience in modem L1/L2 algorithms development and architectures
- Experience in developing link and system level simulators using MATLAB, Python, or C++
- Experience in test setup automation using MATLAB, Python, or Pearl
- Experience with Agile, TDD, BDD, CI, and Git
- Experience developing PHY/MAC layer HW/SW targeting SoCs, FPGAs, and general-purpose processors
- Experience leading technical initiatives and key deliverables
- Experience with version control systems and CI/CD pipeline implementation
- Experience in Bare Metal Environment development, including linker scripts, page tables and NVIC
Qualifications
- 7+ years of ASIC implementation, synthesis, STA and physical design in deep sub-micron nodes (16nm or smaller) experience
- 7+ years of digital design in communication systems experience
- 7+ years of full-custom analog or RF layout experience
- 7+ years of wireless communications systems and implementation experience
- 8+ years of creating and maintaining automation frameworks for Post-Silicon Flow experience
- 7+ years of verification in communication systems experience
- 5+ years of UVM, C, System C, and scripting experience
- 3+ years of emulation experience
- Bachelor's degree in Electrical Engineering or a related field
- Knowledge of UVM and Matlab
- Knowledge of implementing chips with multiple power islands and power gating
- Knowledge of multiple access systems including OFDMA, TDMA, and CDMA
- Knowledge of end-to-end network system architecture from wireless physical layer to application endpoints
- Knowledge of serial protocols including SPI, I2C, I3C, and UART
- Knowledge of Python and Embedded C programming
- Experience in communication theory, OFDM, MIMO, Digital/Wireless Communication Systems or RF engineering
- Experience with current and upcoming RF standards in cellular (4G/5G), WiMAX, 802.11ad, microwave backhaul, DVB-S2 / DVB-C, or related broadband wireless standards
- Experience leading or solely developing methodology and scripts for physical synthesis
- Experience taping out chips that have gone into high volume production
- Experience developing products for volume production
- Experience low power design techniques
- Experience delivering products to volume production
- Experience in modem L1/L2 algorithms development and architectures
- Experience in developing link and system level simulators using MATLAB, Python, or C++
- Experience in test setup automation using MATLAB, Python, or Pearl
- Experience with Agile, TDD, BDD, CI, and Git
- Experience developing PHY/MAC layer HW/SW targeting SoCs, FPGAs, and general-purpose processors
- Experience leading technical initiatives and key deliverables
- Experience with version control systems and CI/CD pipeline implementation
- Experience in Bare Metal Environment development, including linker scripts, page tables and NVIC