Sr. RF Front-End Module Design Engineer (RFIC Engineering)

About the role

We are seeking a motivated and technically excellent Sr. RF Front-End Module Design Engineer to develop cutting-edge RF modules for deployment into the Starlink Mobile network. You would be responsible for the specification, material-selection, design, simulation, integration, fabrication, production, measurement, debug, and optimization of compact, multi-chip modules (MCMs) containing custom RF front-end components. Come join us and contribute to RF systems that will expand the performance and capabilities of Starlink Mobile.

Responsibilities

• Design and develop RF front-end MCMs for 5G NR, LTE, and Wi-Fi applications
• Integrate RFICs (PAs, LNAs, switches), power management ICs, BAW/SAW filters, printed passives, and SMDs into compact MCMs
• Design custom passives (inductors, couplers, etc.) printed into module laminates
• Specify RFIC and BAW filter performances; define pin-to-pin lineups, linearity performances, and coupling specifications of RF modules
• Work closely with BAW filter designers, RFIC designers, and package/layout engineers in module floor-planning
• Perform detailed circuit and EM simulations, and co-simulation of the full module with sub-components
• Conduct lab bring-up, characterization, and debugging of module prototypes; drive learnings into improving and optimizing subsequent prototype iterations
• Manage laminate and assembly suppliers
• Develop ATE test plans and coordinate with OSAT teams on implementation
• Support the integration of RF modules into production PCBAs
• Perform yield analysis and implement design improvements for high-volume production

Requirements

• Bachelor's degree in electrical engineering, computer engineering, or computer science
• 5+ years of research and/or industry experience in RF/Microwave engineering or RFIC engineering
• Ability to work long hours and weekends as necessary to meet critical project milestones

To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C.1157, or (iv) Asylee under 8 U.S.C.1158, or be eligible to obtain the required authorizations from the U.S. Department of State.

Preferred Skills and Experience

• Master’s degree or PhD in an engineering discipline with emphasis in RF/microwave circuits/systems, BAW/SAW resonators, advanced semiconductor packaging, or electromagnetic theory
• Experience in designing multi-chip RF modules for cellular or Wi-Fi applications
• Familiar with MCM substrate/packaging technologies (e.g. double-sided BGA), and manufacturing processes
• BAW filter design experience
• Thorough understanding of RF passive components and EM principles
• Experience in the design of linear and non-linear circuits such as power amplifiers, low noise amplifiers, mixers, filters and PLLs
• Module/RF/microwave design using ADS, HFSS, AWR (or similar tools)
• Experience in MATLAB, Python or equivalent tools for modeling and analyzing RF systems
• Familiar with radio related test equipment such as spectrum analyzers, vector signal analyzers, vector signal generator, network analyzers
• Experience characterizing radio performance for cellular and Wi-Fi systems
• Python programming experience for test automation

Pay

Pay range: $160,000 - $225,000 per year. Your actual level and base salary will be determined on a case-by-case basis and may vary based on job-related knowledge, skills, education, and experience.

Benefits

• Comprehensive medical, vision, and dental coverage
• 401(k) retirement plan
• Short & long-term disability insurance
• Life insurance
• Paid parental leave
• Employee Stock Purchase Plan with stock discounts
• Long-term incentives in the form of company stock, stock options, or long-term cash awards
• Potential discretionary bonuses
• 3 weeks of paid vacation
• 10 or more paid holidays per year
• 5 days of sick leave per year (exempt employees)
• Various discounts and perks