Sr Failure Analysis/Reliability Eng I

Job Summary

This position is responsible for electrical and physical failure analysis of Starkey's microelectronic circuits, flex assemblies, sub-assemblies, and components. Responsible for reliability testing of our microelectronic components, flex and sub-assemblies and final assemblies. Perform full evaluations, create failure analysis reports, and prove recommendations for improvement.

Responsibilities

• Perform electrical analysis/troubleshooting
• Read circuit schematics and layouts
• Identify root cause of failure using bench test equipment such as curve tracer, micro prober, multi-meter, oscilloscope, etc.
• Perform physical failure analysis
• Hands-on analysis of failure using physical analysis tools such as microscopy, cross sections, x-ray, etc.
• Provide recommendations for improvement
• Write failure analysis reports with a clear conclusion
• Participate in design reviews and provide engineering direction as needed
• Use tools (e.g DOE, fault tree analysis) to improve internal quality
• Improve Reliability of Hearing aid products
• Perform additional duties/responsibilities as assigned including equipment maintenance activity, evaluation of new failure analysis techniques and the research and recommendation of capital equipment to enhance failure analysis capabilities

Requirements

• 4-year bachelor's degree in Electrical; MS degree desired
• Minimum 7 years of experience as a failure analysis & reliability engineering in electronic/electromechanical components, subassemblies, or full assemblies is required; or 5 years of experience with MS degree

Knowledge & Technical Requirements

• Strong knowledge of electrical, RF/wireless, mechanical, metallurgical, chemical, and acoustic troubleshooting failure analysis techniques required
• Strong knowledge of printed circuit board manufacturing, both flexible and rigid, required
• Strong knowledge of semiconductor manufacturing processes required
• Strong knowledge of microelectronic assembly processes, including surface mounting, flip chip attach, under filling, cleaning, wire bonding, and thick film technology required
• Strong knowledge of reliability principles and tests, such as environmental stress, mechanical shock, vibration, etc. required
• Knowledge of industry standards, such as MIL-STD, IPC, JEDEC, and ASTM required
• Knowledge of DMAIC methodology or other root cause analysis techniques, such as DOE, fishbone diagram, and 5-why required
• Knowledge of medical device manufacturing desired
• Knowledge of quality systems desired
• Knowledge of new product development systems desired

Skills & Competencies

• Excellent analytical and problem-solving skills required
• Excellent leadership and people skills required
• Strong communication skills required

Working Conditions

Normal office/lab conditions

Equipment Operation

• Microsectioning and microprobing equipment, microscope and environmental chambers
• Oscilloscopes, spectrum analyzers and basic electrical test equipment
• Computer (MS Windows) and associated spreadsheet and word processing software (MS Office)

Pay

The target pay rate for this position is between $93,000 - $131,000 annually. Factors which may affect starting pay within this range may include: geography/market, skills, education, experience and other qualifications of the successful candidate. This position is eligible for a bonus based upon performance results. There is no guarantee of payout.

Benefits

Subject to applicable eligibility requirements, benefits include medical, dental and vision insurance, 401(k) retirement plan with company match, company-paid life and short-term disability insurance, long-term disability insurance, employee assistance plan, hearing aid benefits, Paid Time Off, paid holidays, paid floating holidays, paid volunteer service day, paid paternity and maternity leave and tuition reimbursement.