Sr. Failure Analysis Engineer, SPICE Lab (Seattle)
Key job responsibilities
Conduct failure analysis utilizing electrical fault isolation techniques, physical analysis, spectroscopy, and chemical characterization.
Consultation on corrective actions, method development, design/manufacturing best practices cross-functionally to drive measurable improvements to hardware reliability.
Interface with Senior and Principal engineering staff to identify and execute lab method development spanning enterprise compute assemblies, including power distribution, compute, networking, and thermal management components.
About the team
SPICE lab supports three main functions: Reliability Testing, Failure Analysis, and Materials Characterization. We frequently work together because conducting thorough root cause analysis is valuable for understanding and remedying any issues uncovered as part of a program's reliability testing plan. Likewise, the reliability testing team can help to reproduce failure mechanisms, helping to validate Failure Analysis team's hypotheses. Many of the same techniques are valuable in measuring materials properties or other figures of merit in materials selection exercises.
Basic Qualifications
- Master's degree or above in mechanical engineering, electrical engineering, material science, physics or equivalent
- Adept at electrical characterization techniques for electrical fault isolation (including curve trace, DMM) and materials characterization (SEM/EDS, FTIR, XRF, CT x-ray)
- Experience with enterprise compute thermal solutions. Examples include: 3D vapor chambers, immersion/liquid cooling systems, evaporative cooling infrastructure.
Preferred Qualifications
- Experience with thermal characterization techniques for NTD or fault isolcation, such as lock-in thermography or OBIRCH
- Experience with developing and executing testing for thermal interface materials and/or heatsink devices.