Sr Failure Analysis Engineer (2027 New College Graduate)

About the Role

This position is in the Failure Analysis Laboratory at GlobalFoundries’ 300mm fabrication facility in Malta, New York. The ideal candidate will have a technical understanding of semiconductor failure analysis using sample preparation, imaging, and analytical techniques, along with a solid foundation in semiconductor technology and manufacturing.

Responsibilities

• Support advanced analyses that meet turnaround-time requirements without compromising quality.
• Collaborate with laboratory shift teams, engineers, and managers to define analytical methods, align on analysis expectations, and interpret results.
• Work closely with Process Integration, Process Module, Product Engineering, and Customer Engineering organizations to meet technology requirements and deadlines.
• Identify and address opportunities to improve workflow optimization, cycle time, equipment utilization, and cost.
• Actively participate in continuous-improvement activities and laboratory process enhancements.
• Communicate effectively, both verbally and in writing, with peers and cross-functional teams.
• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

Qualifications

• Graduating with Master’s in Physics, Materials Science, Optical Engineering, Electrical Engineering, Mechanical Engineering, Chemical Engineering, or related field from an accredited degree program.
• Must have at least an overall 3.0 GPA and proven good academic standing.
• English fluency (Written & Verbal).
• Able to relocate to Malta, NY.
• Willing to travel up to 10%.

Preferred Qualifications

• Prior related internship or co-op experience.
• Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
• Strong interest in leveraging AI tools and emerging technologies to enhance productivity, streamline workflows, and support effective decision-making.
• Project management skills, including the ability to innovate and execute solutions, and navigate ambiguity.
• Strong written and verbal communication skills.
• Strong planning & organizational skills.
• Relevant failure-analysis experience, preferably including knowledge of wafer processes and semiconductor materials or device characterization.
• Hands-on analytical experience with failure-localization methods such as OBIRCH, emission microscopy, thermal microscopy, laser-based techniques, electron-beam-based failure-analysis techniques, and TEM imaging.
• Experience with sample preparation, cross-sectioning, and analytical techniques such as SEM, FIB, X-ray analysis, C-SAM, Auger electron spectroscopy, AFM, or SIMS.
• Self-driven approach, exceptional analytical skills, structured work style, and ability to understand complex matters quickly.
• Proficiency in MS Office Suite.

Pay

Expected Salary Range: $69,000.00 - $120,000.00. The exact salary will be determined based on qualifications, experience, and location.