Sr. Detector/Instrument Engineer
Columbus Technologies and Services · Greenbelt, MD · Yesterday
On-siteEngineeringFull-time
About the role
The Columbus Technologies & Services at NASA Goddard Space Flight Center is seeking a talented microfabrication engineer to contribute to advanced technology for internal projects.
Responsibilities
- Oversee and direct detector/instrument engineering activities
- Develop and optimize microfabrication processes for MEMS devices
- Troubleshoot process issues and implement solutions
- Collaborate with cross-functional teams in design, test, and integration
- Document procedures and results according to industry standards
- Contribute to continuous improvement initiatives for fabrication processes
Requirements
- Bachelor’s degree in electrical engineering, mechanical engineering, chemical engineering, materials science, physics, or related field; MS or PhD preferred
- Minimum 3 years of hands-on experience in semiconductor or MEMS fabrication environments
- Demonstrated expertise in photolithography processes including photoresist application, exposure systems, such as stepper tools or E-beam lithography, and pattern development
- Comprehensive knowledge of thin film deposition methods including: Physical vapor deposition (thermal/e-beam evaporation and sputtering), Chemical vapor deposition (PECVD), Thermal oxidation processes, Atomic Layer Deposition (ALD)
- Proficiency in etching techniques including: Wet chemical etching of metals and dielectric films, Plasma-based dry etching (RIE), Deep Reactive Ion Etching (DRIE), Specialty vapor phase etching (vapor HF and XeF2)
- Experience operating metrology and characterization equipment: Optical and electron microscopy, Ellipsometry for film thickness measurement, Stress measurement techniques for thin films, Electrical probing and device characterization
Desired Skills
- Cleanroom experience in class 10-1000 environments
- Familiarity with process integration and optimization
- Experience with Design of Experiments methodology
- Knowledge of MEMS design principles and fabrication challenges