Software Engineering Director/Architect, 3DIC P&R & AI-driven EDA Automation

Core Responsibilities

• Build scalable EDA flows using C++, Tcl, Python, and Java.
• Develop AI/LLM-based automation for 3DIC applications, including flow generation, debugging assistants, and root-cause analysis capabilities.
• Integrate 3DIC flows into a broader platform system supporting 3DIC, interposer, and RDL system flows.
• Design and automate workflows that improve usability, productivity, and debug efficiency for complex package and system-level design challenges.
• Collaborate with cross-functional engineering teams to define requirements, validate flow behavior, and deliver production-quality solutions.

Required Skills

• Strong background in EDA data structures and algorithms.
• Hands-on experience with Tcl, Python, and C++ automation in EDA tools.
• Experience with DB-driven design flows, such as Innovus or similar implementation platforms.
• Understanding of 3DIC, interposer, packaging routing, and RDL design flows.
• Knowledge of constraint-driven design, including timing, signal integrity, DRC, and related implementation constraints.
• Experience handling large-scale design problems, including high bump-count designs and multi-region routing challenges.

Preferred Skills

• Experience with 3DIC, 3.5D, or 2.5D designs.
• Familiarity with signal integrity, EMIR, and thermal considerations in advanced packaging environments.
• Experience with LLM or AI systems, including agent frameworks and prompt-to-script automation.
• Knowledge of multi-tool integration and end-to-end flow automation.
• Ability to translate complex EDA workflows into scalable, user-friendly automation solutions.

Education and Experience

• Bachelor’s or Master’s degree in Computer Science, Electrical Engineering, Computer Engineering, or a related technical field.
• Relevant industry experience developing EDA software, design automation flows, AI/LLM-enabled engineering tools, or advanced packaging design solutions.