SMTS Photonics Advanced Packaging Integration

About GlobalFoundries

GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. Our Advanced Packaging and Photonics Center (APPC) is at the forefront of enabling next-generation optical interconnects and heterogeneous integration (HI) for AI, HPC, and data center applications. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

About the role

As a Photonic Packaging Engineer within GF’s APPC, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms. You will collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss, and cost-effective packaging architectures that meet stringent performance and reliability targets.

Responsibilities

• Own the definition, design, and qualification of optical packaging architectures for SiPh-based modules, including fiber attach, photonic die placement, and thermal/mechanical integration.
• Develop and implement scalable fiber-to-chip coupling strategies (e.g., V-groove, passive alignment, lens integration) for high-density optical I/O.
• Drive heterogeneous integration (HI) of photonic and electronic components using 2.5D/3D/3.5D packaging technologies (e.g., TSV, Cu-Cu hybrid bonding, advanced molded integration).
• Perform multiphysics simulations (thermal, mechanical, optical) to optimize package performance and reliability.
• Lead root cause analysis and corrective actions for yield and reliability issues using FMEA, DOE, and FA tools.
• Collaborate with OSATs and internal manufacturing teams to ensure mass production readiness and process transfer.
• Support cost modeling and drive package cost reduction initiatives aligned with GF’s B2B supply chain strategy.
• Present technical updates and roadmaps to internal stakeholders and external partners.
• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

Required Qualifications

• Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering, or related field.