Silicon Photonics Advanced Packaging Intern (Summer 2027)

Internship Program Overview

Our Interns & Co-ops are our entry-level talent pipeline for GF across the globe. Our goal is to provide students with a meaningful work experience that will equip them with the skills to embark on a career in the fast-paced and growing semiconductor industry after graduation. As an intern at GF, you’ll experience one-on-one mentorship, work assignments that prioritize your growth and potential, professional development opportunities, and the chance to network with executives.

About the Role

GlobalFoundries (GF) is seeking a summer 2027 intern to support the development of industry-leading electro-optical transceivers using GF's Photonix platform and advanced 2.5D and 3D co-packaged optics form factors. This hands-on role will contribute to thermal, mechanical, electrical, and optical chip-package co-design with a focus on module performance, reliability, packaging design, materials selection, and advanced chiplet integration requirements.

Responsibilities

• Support Silicon Photonics advanced packaging innovation and customer design enablement by contributing to packaging design rules, product requirements, and efficient manufacturing processes with internal teams and OSAT ecosystem partners.
• Participate in cross-functional design reviews and use engineering analysis to help resolve technical, manufacturability, reliability, and yield concerns for new customer products.
• Develop and apply analysis or simulation models to evaluate package performance, manufacturability, cost, and quality, and document findings and recommendations for engineering stakeholders.
• Contribute to qualification robustness and continuous improvement plans by applying consistent design processes, tracking requirements, and supporting product development from concept through production readiness.
• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

Required Qualifications

• Actively pursuing a Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Photonics, Optical Engineering, Packaging Engineering or a related field through an accredited degree program during the internship.
• Must have at least an overall 3.0 GPA and be in good academic standing.
• Language Fluency - English (Written & Verbal).
• Travel - Up to 10%.
• Ability to work at least 40 hours per week during the internship.

Preferred Qualifications

• Prior related internship, research, or co-op experience in semiconductor packaging, photonics, optics, or advanced electronics.
• Demonstrated leadership experience through academic projects, student organizations, competitions, or prior employment.
• Strong interest in leveraging AI tools and emerging technologies to enhance productivity, streamline workflows, and support effective decision-making.
• Project management skills and the ability to innovate and execute solutions in ambiguous environments.
• Strong written and verbal communication skills.
• Strong planning and organizational skills.
• Exposure to thermal, mechanical, electrical, optical, or multiphysics simulation tools.
• Knowledge of semiconductor packaging, chiplets, silicon photonics, or co-packaged optics is a plus.

Pay

Expected Salary Range: $20.00 - $40.00