Senior Technical Program Manager, Annapurna Labs Silicon Operations

About the role

AWS‑Annapurna team develops the silicon used in our most advanced machine‑learning accelerator servers at cutting‑edge process nodes. These SoCs power massively scaled server clusters, providing the best hardware platform for customers to run training and inference workloads. The final product is a server, not just the silicon, so the role stretches beyond traditional silicon product‑engineering boundaries and involves system issues and data‑set challenges, offering ample learning opportunities. We are seeking a Senior Technical Program Manager to own end‑to‑end execution for complex silicon products from development through qualification, production ramp, and high‑volume manufacturing. The manager will own the integrated product schedule across Product Engineering, Test Engineering, Design, DFT, System Validation, Packaging, Quality, Reliability, Supply Chain, Foundry, OSAT, and external silicon partners, driving outcomes rather than status updates.

Key responsibilities

• Own the end‑to‑end silicon product schedule from tapeout and first silicon through bring‑up, characterization, qualification, production release, ramp, and HVM.
• Build and maintain integrated execution plans across silicon, package, test, quality, reliability, manufacturing, and supply‑chain dependencies.
• Define milestones, entry and exit criteria, owners, critical paths, and recovery plans.
• Drive Product Engineering, Test Engineering, Design, DFT, Packaging, System Validation, Quality, Reliability, and Supply Chain teams to committed deliverables.
• Dive deep on execution blockers; identify owner, root cause, decision required, and recovery path.
• Drive closure of risks affecting schedule, quality, yield, test coverage, qualification, cost, capacity, or production readiness.
• Own execution and communication of schedules and needs across foundry, OSAT, and other external manufacturing partners.
• Identify long‑lead dependencies early (wafer starts, masks, test hardware, package material, sockets, load boards, qualification hardware, equipment capacity) and translate product demand into manufacturing‑capacity requirements.
• Drive readiness reviews for first silicon, characterization, qualification, production release, and volume ramp.
• Establish mechanisms that expose schedule health, risks, decisions, and dependencies without relying on manual status collection.
• Escalate early when teams cannot meet commitments, presenting options, trade‑offs, and a recommended path.
• Drive decisions when engineering quality, schedule, cost, capacity, and product requirements conflict.
• Communicate program health to senior leadership with clear facts: what changed, why it matters, what decision is required, who owns the action, and when it will close.
• Identify recurring execution failures and implement mechanism changes to prevent recurrence on subsequent products.
• Scale common planning, readiness, and execution mechanisms across multiple silicon programs.

About the team

Our team focuses on delivering technology programs that create real impact for Amazon’s customers. We value collaboration, clear communication, and a willingness to tackle hard problems together. We are building an inclusive environment where program managers and engineers work side by side to simplify complex systems and ship meaningful improvements. If you want a role where your program‑management expertise directly shapes outcomes and where you can grow alongside talented colleagues, this is the team for you.

Basic qualifications

• Bachelor’s degree in engineering, management, or technology.
• 5+ years of experience in semiconductor product engineering, test engineering, silicon operations, manufacturing, or technical program management.
• Demonstrated ownership of semiconductor programs through major milestones such as tapeout, first silicon, bring‑up, characterization, qualification, production release, ramp, or HVM.
• Working knowledge of semiconductor product‑development and manufacturing flows across wafer fabrication, wafer sort, package assembly, final test, SLT, characterization, qualification, reliability, yield, and failure analysis.
• Experience driving execution across engineering teams that do not report to you.

Preferred qualifications

• Experience with CPU, GPU, AI/ML accelerator, networking, or other large advanced‑node SoCs.
• Experience driving products into high‑volume manufacturing.
• Experience with advanced packaging, chiplets, 2.5D/3D integration, or HBM.
• Experience with ATE, SLT, product characterization, manufacturing test, yield ramp, and product qualification.
• Direct experience with leading foundry and OSAT partners.
• Experience managing capacity across wafer, package, assembly, and test.
• Experience owning multiple products or silicon generations concurrently.
• Experience creating execution mechanisms for a silicon organization that is scaling rapidly.

Pay

Base salary range: $148,700 – $201,200 USD annually. Total compensation includes sign‑on payments and restricted stock units (RSUs); final amount is determined based on experience, qualifications, and location.

Benefits

• Comprehensive health insurance (medical, dental, vision, prescription).
• Basic Life & AD&D insurance with optional supplemental life plans.
• Employee Assistance Program (EAP) and mental‑health support.
• Medical advice line.
• Flexible Spending Accounts.
• Adoption and surrogacy reimbursement coverage.
• 401(k) matching.
• Paid