Senior RTL Engineer, IO Die and Interconnect IP

Our technology solutions power the tools you use every day—including smartphones, electric vehicles, hyperscale data centers, IoT devices, and so much more. Here, you’ll have an opportunity to be part of a global leader whose innovative designs are pushing the boundaries of what’s possible and powering the future. We believe innovation and growth are driven by an inclusive culture and a diverse workforce. We’re dedicated to empowering people to be their true selves. Together, we’re building a better tomorrow for our employees, customers, partners, and communities.

About the role

The AGI (Artificial General Intelligence) Computing Lab is dedicated to solving the complex system-level challenges posed by the growing demands of future AI/ML workloads. Our team is committed to designing and developing scalable platforms that can effectively handle the computational and memory requirements of these workloads while minimizing energy consumption and maximizing performance. To achieve this goal, we collaborate closely with both hardware and software engineers to identify and address the unique challenges posed by AI/ML workloads and to explore new computing abstractions that can provide a better balance between the hardware and software components of our systems. Additionally, we continuously conduct research and development in emerging technologies and trends across memory, computing, interconnect, and AI/ML, ensuring that our platforms are always equipped to handle the most demanding workloads of the future.

Location: Daily onsite presence at our San Jose, CA office / U.S. headquarters in alignment with our Flexible Work policy.

Responsibilities

• Develop RTL (Verilog/SystemVerilog) for the IO die, integrating UCIe, PCIe, and other high-speed interconnect IP into a cohesive chiplet-based architecture.
• Integrate internal and third-party interconnect IP — UCIe, PCIe, CXL, die-to-die, and NoC — into the IO die, including configuration, glue logic, clock/reset, and interface bridging.
• Modify and customize PCIe and other interconnect IP as needed — controller, PIPE/PHY interface, and configuration logic — to meet die-level requirements and close functional gaps.
• Define and implement die-to-die and chiplet interfaces using UCIe, ensuring protocol compliance and interoperability across chiplets.
• Own the microarchitecture and RTL for IO subsystems such as PCIe/CXL controllers, UCIe adapters, and interconnect fabric bridges.
• Collaborate with verification engineers to develop test plans and debug functional issues at the IP, subsystem, and die level.
• Work with architecture, PHY/SerDes, physical design, and software teams to close requirements across performance, power, area, and interoperability.
• Make design decisions out of a large design trade-off space across performance, power, latency, bandwidth, and cost.
• Develop and automate IP integration and RTL assembly flows using scripting and agentic AI tools and frameworks to improve turnaround time and quality of results.
• Communicate effectively with stakeholders, including users, partners, and management, to ensure that the die is delivered on time and within budget.
• Complete other responsibilities as assigned.

Requirements

• Bachelor’s with 5+ years, or Master’s with 3+ years, or PhD's with 0+ years of industry experience.
• Strong background in microarchitecture and RTL design for complex SoC and die integration.
• 5+ years of experience in RTL development (Verilog/SystemVerilog) for high-speed interconnect and IO subsystems.
• Hands-on experience integrating and configuring interconnect IP such as PCIe, CXL, UCIe, and die-to-die interfaces.
• Experience modifying or customizing third-party interconnect IP (e.g., PCIe controller, PIPE, or PHY interface) to meet die-level requirements.
• Familiarity with UCIe and chiplet-based, multi-die architectures and die-to-die interconnect.
• Solid understanding of PCIe/CXL protocol stacks (transaction, data link, and physical layers) and the PIPE interface.
• Experience with SoC integration methodologies, IP packaging (e.g., IP-XACT), and on-chip interface protocols such as AXI, ACE, CHI, or APB.
• Proficiency in scripting (Tcl, Python, or Perl) for design integration and automation; familiarity with agentic AI tools and frameworks is a plus.
• Experience in AI/ML workloads.
• Strong analytical and problem-solving skills.
• Excellent communication and interpersonal skills.
• Ability to work independently and as part of a team.
• Inclusive, adapting your style to the situation and diverse global norms of our people.
• An avid learner, approaching challenges with curiosity and resilience, seeking data to help build understanding.
• Collaborative, building relationships, humbly offering support and openly welcoming approaches.
• Innovative and creative, proactively exploring new ideas and adapting quickly to change.

Benefits

• Medical, dental, and vision coverage.
• 401k retirement plan.
• Charitable giving match and frequent opportunities to get involved in community support.
• 4+ weeks of paid time off a year, plus holidays and sick leave.
• Stipend for fertility care or adoption, medical travel support, and virtual vet care for pets.
• On-demand apps and free confidential therapy sessions for emotional wellness.
• Onsite café and gym, plus virtual fitness classes.
• Flexible work environment.

Pay

Base Pay Range: $138,000—$206,000 USD. We also offer incentive opportunities that reward employees based on individual and company performance.