Senior Product Engineer, Product Engineering

About the role

Amazon Leo is an initiative to launch a constellation of Low Earth Orbit satellites providing low-latency, high-speed broadband connectivity to unserved and underserved communities.

Responsibilities

• Review system and product specs and define appropriate stage-gate criteria with TE for product development and qualification.
• Review process & technology selection for product, based on application, design architecture and identify key risks.
• Collaborate with packaging team in reviewing package design, configuration and BoM choices. Incorporate product-package considerations into char & qual plans.
• Develop & execute de-risking strategies to address technology risks to product development.
• Drive test program reviews with design, test, DVT and system teams.
• Define test plans & test coverage for production lots, corners lots, and pre-/post-qualification based on system specs, and yield & Cpk targets.
• Collaborate with TE to develop & evaluate test program, and proto-Si bring-up.
• Analyze foundry WAT data from development, corner lots and qual lots.
• Define char plans for corner lots in conjunction with design, DVT and systems and in alignment to mission profile and system specs.
• Execute char data collection and analysis on corner lots across voltage and temperature.
• Assess gaps in & drive alignment between ATE and bench test programs and drive resolution of mismatch between ATE & bench results.
• Analyze bench-ATE correlation data and implement appropriate offsets / transforms to ATE data to match back to golden bench results.
• Complete char data analysis to derive guard bands for production test program and confirm compliance to system specs.
• Work with design / TE to identify bugs, and support fixes during product bring-up.
• Design & execute GR&R data collection on initial test hardware set-ups to demonstrate gauge capability to product specs – drive follow-up actions such as test program de-bug, spec relaxation with system team as appropriate.
• Drive test-time reduction by AI & ML techniques such as RF-DC and FT-WS correlation and reject-oriented analysis, optimizing for test coverage, quality, yield & cost.
• Define qual plans based on evaluation of mission profile and execute to defined qual plans, projecting FIT rate and dppm estimates based on technology parameters, system application & product lifetime targets.
• Identify root cause and drive fixes for any failures reported during qual.
• Publish comprehensive product qualification, characterization and release to production documentation for review and approval by relevant stakeholders.

Requirements

• Bachelor's degree in Electrical/Communications Engineering, or equivalent experience in electrical engineering.
• 10+ years of semiconductor product engineering or foundry process operations, preferably in high-volume wireless SoC devices manufacturing.

Qualifications

• Masters or PhD degree in Electrical / Communications Engineering or related field.
• Excellent oral and written communications skills.
• Strong technical background in RF product development and characterization experience.
• Knowledge of digital and Serdes testing.
• Experience interfacing with suppliers and external partners.
• Proficiency in statistics, data analysis and YMS products such as Exensio and JMP – scripting skills preferred.
• New product introduction, with transition from design phase, through qualification and into high volume manufacturing environment.
• Conversant with failure analysis techniques such as FIB, SEM, IR, EMMI, and CSAM.
• Knowledgeable with package technologies such as FCBGA, FCCSP, WLCSP, and QFN.

Benefits

Comprehensive benefits including health insurance, retirement plans, paid time off, and parental leave.

Pay

Base salary range: $159,200.00 - $215,300.00 USD annually

Schedule

Full-time position.