Jobs · Manufacturing · California

Senior Process Engineer -Optoelectronics/ CPO

Molex · Fremont, CA · 6 days ago
On-siteManufacturing$160k–$250k/yrFull-time

About the role

Molex seeks a Senior Process Engineer to develop and implement processes for advanced optoelectronic packages, collaborating with R&D, product design, manufacturing, suppliers, and customers to meet stringent optical, mechanical, and Telcordia reliability requirements.

Responsibilities

  • Develop and implement processes to attach various components (e.g., TEC, housing, lid, fiber lens or discrete lenses)
  • Own automated process development using die-attach tools (MRSI), including: process set up, alignment and recipes
  • Design and implement solder hierarchies (e.g., AuSn, SAC, etc.) to support multiple reflows without reflow or voiding
  • Develop hermetic lid-sealing process via electrical or laser welding, or soldering to seal ring
  • Develop hermetic fiber-sealing process to housing (e.g., glass frit, Cerrocast) to achieve leak rate (< 10-8 He std atm-cc /s) and high-proof strength (> 5N)
  • Partner with product and operation teams to ensure designs are compatible with manufacturable, high-yield assembly flows
  • Define process windows, control plans, and critical-to-quality (CTQ) parameters
  • Support component supplier selection and evaluation of: housing, lid, seal rings, fiber-feedthrough. Evaluate process capability and maturity
  • Define and oversee component pre-qualification tests to ensure reliable designs (e.g., temperature cycling, damp heat resistance)
  • Support failure analysis investigations and corrective actions for product related failures and manufacturing issues (e.g., solder defects (cracks, delamination))
  • Drive corrective actions across materials, processes and supplier inputs

Requirements

  • MS in Material Science, Mechanical Engineering, Physics, Optics, or a closely related field
  • At least 10 years of industry R&D experience with solder/epoxy processes used for optoelectronic packages developed and transferred to manufacturing environments
  • Hands-on experience with DOE, DFM, statistical tools for efficient optimization (e.g., Minitab or JMP)
  • Expertise in solder hierarchy reflow applied to metalized surfaces and bare-glass surfaces
  • Experience of process-attach issues (e.g., CTE mismatch, stress, adhesion, thermal limits, etc.)
  • Expertise in component qualification methodologies (e.g., GR-468), and product reliability testing
  • Experience with solder-process failures (e.g., cracks, intermetallics, solder fatigue) through failure mode analysis tools
  • Experience with New Product Introduction (NPI) methodology: design, verification, qualification, release to manufacturing
  • Strong communication skills with suppliers and cross-functional internal teams

Qualifications

  • MS in Material Science, Mechanical Engineering, Physics, Optics, or a closely related field
  • At least 10 years of industry R&D experience with solder/epoxy processes used for optoelectronic packages developed and transferred to manufacturing environments
  • Hands-on experience with DOE, DFM, statistical tools for efficient optimization (e.g., Minitab or JMP)
  • Expertise in solder hierarchy reflow applied to metalized surfaces and bare-glass surfaces
  • Experience of process-attach issues (e.g., CTE mismatch, stress, adhesion, thermal limits, etc.)
  • Expertise in component qualification methodologies (e.g., GR-468), and product reliability testing
  • Experience with solder-process failures (e.g., cracks, intermetallics, solder fatigue) through failure mode analysis tools
  • Experience with New Product Introduction (NPI) methodology: design, verification, qualification, release to manufacturing
  • Strong communication skills with suppliers and cross-functional internal teams

Skills

  • Material Science
  • Mechanical Engineering
  • Physics
  • Optics
  • Die-Attach Tools (MRSI)
  • Solder Hierarchy Reflow
  • Laser Welding
  • Soldering
  • Component Qualification Methodologies
  • New Product Introduction (NPI)
  • Failure Mode Analysis
  • Supplier Evaluation
  • Process Capability and Maturity
  • Component Pre-Qualification Tests
  • Product Reliability Testing
  • Corrective Actions

Benefits

This role is eligible for a base salary of $160,000 - $250,000 per year, with the possibility of variable pay in the form of a monetary bonus or other forms. Specific details regarding benefits are provided in the document.

Pay

$160,000 - $250,000 per year

Schedule

N/A

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