Senior Process Engineer -Optoelectronics/ CPO
Molex · Fremont, CA · 6 days ago
On-siteManufacturing$160k–$250k/yrFull-time
About the role
Molex seeks a Senior Process Engineer to develop and implement processes for advanced optoelectronic packages, collaborating with R&D, product design, manufacturing, suppliers, and customers to meet stringent optical, mechanical, and Telcordia reliability requirements.
Responsibilities
- Develop and implement processes to attach various components (e.g., TEC, housing, lid, fiber lens or discrete lenses)
- Own automated process development using die-attach tools (MRSI), including: process set up, alignment and recipes
- Design and implement solder hierarchies (e.g., AuSn, SAC, etc.) to support multiple reflows without reflow or voiding
- Develop hermetic lid-sealing process via electrical or laser welding, or soldering to seal ring
- Develop hermetic fiber-sealing process to housing (e.g., glass frit, Cerrocast) to achieve leak rate (< 10-8 He std atm-cc /s) and high-proof strength (> 5N)
- Partner with product and operation teams to ensure designs are compatible with manufacturable, high-yield assembly flows
- Define process windows, control plans, and critical-to-quality (CTQ) parameters
- Support component supplier selection and evaluation of: housing, lid, seal rings, fiber-feedthrough. Evaluate process capability and maturity
- Define and oversee component pre-qualification tests to ensure reliable designs (e.g., temperature cycling, damp heat resistance)
- Support failure analysis investigations and corrective actions for product related failures and manufacturing issues (e.g., solder defects (cracks, delamination))
- Drive corrective actions across materials, processes and supplier inputs
Requirements
- MS in Material Science, Mechanical Engineering, Physics, Optics, or a closely related field
- At least 10 years of industry R&D experience with solder/epoxy processes used for optoelectronic packages developed and transferred to manufacturing environments
- Hands-on experience with DOE, DFM, statistical tools for efficient optimization (e.g., Minitab or JMP)
- Expertise in solder hierarchy reflow applied to metalized surfaces and bare-glass surfaces
- Experience of process-attach issues (e.g., CTE mismatch, stress, adhesion, thermal limits, etc.)
- Expertise in component qualification methodologies (e.g., GR-468), and product reliability testing
- Experience with solder-process failures (e.g., cracks, intermetallics, solder fatigue) through failure mode analysis tools
- Experience with New Product Introduction (NPI) methodology: design, verification, qualification, release to manufacturing
- Strong communication skills with suppliers and cross-functional internal teams
Qualifications
- MS in Material Science, Mechanical Engineering, Physics, Optics, or a closely related field
- At least 10 years of industry R&D experience with solder/epoxy processes used for optoelectronic packages developed and transferred to manufacturing environments
- Hands-on experience with DOE, DFM, statistical tools for efficient optimization (e.g., Minitab or JMP)
- Expertise in solder hierarchy reflow applied to metalized surfaces and bare-glass surfaces
- Experience of process-attach issues (e.g., CTE mismatch, stress, adhesion, thermal limits, etc.)
- Expertise in component qualification methodologies (e.g., GR-468), and product reliability testing
- Experience with solder-process failures (e.g., cracks, intermetallics, solder fatigue) through failure mode analysis tools
- Experience with New Product Introduction (NPI) methodology: design, verification, qualification, release to manufacturing
- Strong communication skills with suppliers and cross-functional internal teams
Skills
- Material Science
- Mechanical Engineering
- Physics
- Optics
- Die-Attach Tools (MRSI)
- Solder Hierarchy Reflow
- Laser Welding
- Soldering
- Component Qualification Methodologies
- New Product Introduction (NPI)
- Failure Mode Analysis
- Supplier Evaluation
- Process Capability and Maturity
- Component Pre-Qualification Tests
- Product Reliability Testing
- Corrective Actions
Benefits
This role is eligible for a base salary of $160,000 - $250,000 per year, with the possibility of variable pay in the form of a monetary bonus or other forms. Specific details regarding benefits are provided in the document.
Pay
$160,000 - $250,000 per year
Schedule
N/A