Senior Process Engineer - H1

Duties And Responsibilities

• Lead the development and optimization of manufacturing processes of thin film lithium niobate photonic integrated circuits
• Drive process integration and improvement initiatives to enhance device performance and yield
• Work closely with the process team in the cleanroom to optimize associated metrology measurements in the fabrication flow of TFLN chips
• Collaborate with stakeholders across the manufacturing organization, including the design and measurement teams to deliver high quality photonic integrated circuits
• Utilize advanced metrology tools such as CD SEM, AFM, ellipsometry, profilometry, XPS, XRD, and optical interferometry for process characterization and defect analysis
• Troubleshoot process deviations, particle contamination, and performance issues and implement corrective actions and continuous improvement strategies
• Support high priority customers throughout the design, fabrication and testing phases of their projects

Required Skills And Experience

• Master’s, or Ph.D. in Materials Science, Electrical Engineering, Physics, or related field
• 5+ years of experience in process engineering
• Strong background in measurement and / or design of photonic integrated circuits
• Hands-on experience with metrology tools such as CD SEM, Alignment, Film Thickness Characterization, Particle Measure for process verification and defect analysis
• Strong problem-solving skills with experience in data analysis, SPC, and DOE
• Able to work in a cleanroom environment and interface with cross-functional engineering teams
• Must have or be able to obtain a US DoD Security Clearance

Preferred Qualifications

• Ph.D. in Materials Science, Electrical Engineering, Physics, or related field
• Experience and understanding of microfabrication for photonics devices, process integration, photonic materials properties and modification, and the incorporation of MEMS and electronic devices
• Experience modeling and measuring photonic integrated circuits
• Experience with microwave and or RF photonics
• Experience with heterogeneous bonding between wafers and chips is valued
• Experience with 5S, and 6 Sigma

About Us

Quantum Computing Inc. (QCi) (Nasdaq: QUBT) is an innovative, integrated photonics company that provides accessible and affordable quantum machines to the world today. QCi products are designed to operate at room temperature and low power at an affordable cost. The Company’s portfolio of core technology and products offer unique capabilities in the areas of high-performance computing, artificial intelligence, cyber security as well as remote sensing applications.

Qualifications

Quantum Computing Inc. (QCi) is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, protected veteran status, or any other characteristic protected by applicable federal, state, or local law.

Benefits

Quantum Computing Inc. (QCi) offers a competitive compensation package, including health insurance, retirement plans, and paid time off.

Pay

The salary range for this position is $120,000 - $150,000 annually.

Schedule

The schedule for this position is full-time, Monday through Friday, with occasional evening and weekend work as needed.