Senior / Principal Silicon Photonic Packaging & Process Engineer

Voyant Photonics, based in the heart of New York City, is transforming machine perception with a new class of LiDAR devices that are compact, powerful, and affordable. Our silicon photonic chips enable sensors that measure range, velocity, and reflectivity with unparalleled accuracy, making high-precision sensing accessible for robotics, autonomous vehicles, drones, industrial automation, and beyond.

About the role

As a Principal Silicon Photonic Packaging & Process Engineer, you will lead the development and scaling of precision opto-mechanical assembly processes. You will collaborate with photonics, mechanical, and test teams to translate design concepts into R&D builds and repeatable production processes. Partnering with contract manufacturers, you will qualify production lines, improve yields, and drive continuous process improvements. This role requires up to 25% domestic and international travel to support process transfer, line qualification, and build execution at manufacturing partners.

Responsibilities

• Package Design: Work with organic and ceramic substrates, wafer-level packaging, and 2.5D/3D assembly processes. Engage with substrate suppliers and assembly houses to design mechanically, thermally, and electrically optimal solutions within supplier capabilities. Create CAD models for simulation and verify designs prior to release.
• Precision Lens Assembly: Define and control automated microlens alignment and bonding processes. Program motion sequences, optimize vision-based routines, and tune process parameters (alignment offsets, bonding dwell, UV cure profiles, placement forces) to achieve sub-micron accuracy and high yield.
• Die Placement Process Ownership: Define and maintain process parameters for high-precision die-attach and placement equipment. Drive correlation between pick-and-place accuracy, epoxy flow, and bond-line thickness for consistent optical coupling.
• Epoxy and Adhesive Dispense Control: Establish and control parameters for automated dispense systems, including needle diameter, pressure, time, temperature, and material conditioning. Characterize cure profiles and shrinkage impacts on optical alignment stability.
• Yield and DOE Execution: Design and execute structured DOEs to characterize process sensitivity and optimize yield. Use statistical methods to quantify variability and identify dominant factors affecting alignment accuracy, void formation, or optical loss.
• Reliability and Qualification: Apply microelectronics and photonics reliability standards (e.g., Telecordia, JESD47, AEC-Q). Lead Root Cause Corrective Actions (RCCAs), Design and Process FMEAs, and DOE planning with suppliers.
• Measurement and GR&R: Define measurement methods and conduct GR&R studies on critical parameters (e.g., placement accuracy, epoxy volume, bond-line thickness). Ensure metrology tools and data systems at contract manufacturers are calibrated and controlled.
• Factory Execution and Scale-Up: Lead implementation of robotics, automation, and material handling solutions with suppliers and contract manufacturers. Drive failure analysis and corrective actions to improve yield, throughput, and takt time. Qualify processes, train operators, and ensure line readiness for precision optical assembly builds.

Requirements

• BS or MS in Mechanical, Manufacturing, Photonics, or Electrical Engineering (or equivalent experience).
• 10+ years of hands-on experience in semiconductor, photonics packaging, or precision opto-mechanical assembly environments.
• CAD modeling and simulation experience (SolidWorks preferred).
• Deep familiarity with automated alignment and die-attach systems.
• Strong understanding of adhesive dispense physics (viscosity, wetting, cure shrinkage) and related automation equipment.
• Proficiency with DOE methods, SPC, and Minitab (or equivalent tools).
• Demonstrated experience working with automation solution providers and contract manufacturers to transfer and adapt prototype processes into high-volume production.
• Excellent problem-solving skills and ability to collaborate across mechanical, optical, and test teams.
• Willingness to travel up to 25% domestically and internationally.

Preferred Qualifications

• Experience with automated micro-optics or fiber alignment processes.
• Experience in standard optics alignment and assembly for lens-to-PIC coupling.
• Familiarity with standard micro-electronic assembly (die attach, wire bond, hermetic lid seal, PCBA/SMT).
• Understanding of cleanroom protocols and ESD control best practices.
• Familiarity with ISO 9001 process control or automotive-style production quality systems.
• Understanding of photonic packaging materials (epoxies, UV adhesives, underfills) and their environmental stability.
• Background in precision metrology systems (e.g., digital microscopes, interferometers, or confocal profilers).
• Experience with Finite Element Analysis for mechanical and thermal simulations.

Pay

$150K - $250K