Senior / Principal PIC Test Engineer

About the role

Role Overview We are seeking an experienced PIC Test Engineer with deep expertise in both wafer- level and die-level optical and electrical test for Photonic Integrated Circuits (PICs). This role will own the test strategy and execution across the full product lifecycle—from early silicon bring-up through high-volume manufacturing (HVM). The ideal candidate is a recognized technical authority in test architecture, PIC Design-for-Test (DFT), yield learning, and factory scalability, with proven leadership in driving robust test solutions across multiple technology nodes and product families.

Responsibilities

• Define and own the wafer-level PIC test roadmap across multiple product lines and technology platforms.
• Architect scalable, high-throughput optical + electrical wafer probe solutions, balancing alignment accuracy, probe stability, and test time.
• Establish release criteria, guard-banding strategy, and wafer test coverage models aligned with product requirements.
• Define and own tests not carried out at wafer level. Examples include Optical Vector Analysis (OVA) testing, and polariazation-resolved testing.
• Lead first-silicon bring-up efforts, including test content definition, limit setting, and characterization flows.
• Drive rapid yield-learning loops in partnership with design, process integration, and fabrication teams.
• Enable fast debug and iteration during early node transitions and new platform ramps.
• Influence PIC Design-for-Test features and PDK structures to improve wafer-level Scalability, Including On-chip monitors Loopback paths Test waveguides Calibration structures
• Partner with design teams to embed manufacturable test hooks early in the development cycle.
• Own wafer-level yield, parametric distributions, and systematic defect learning.
• Perform advanced spatial analytics using wafer maps and statistical methods to separate random vs systematic process issues.
• Lead root-cause investigations related to lithography bias and process drift.
• Establish golden wafer / golden die methodologies for production stability and tool correlation.
• Partner with foundries and OSATs to qualify wafer-level optical probe infrastructure.
• Drive successful transfer of test flows into volume manufacturing environments with strong cross-tool correlation.
• Serve as the technical escalation point during yield crises and manufacturing transitions.
• Mentor and develop junior engineers, setting engineering standards and best practices across wafer-level test programs.
• Multiply organizational impact through scalable infrastructure, DFT influence, and test standardization.

Qualifications

Required:

• 10+ years of experience in PIC test engineering, wafer-level probing, or photonics manufacturing test.
• Proven ownership of wafer-level optical/electrical test strategy from R&D through HVM.
• Expertise In Wafer-level optical probingDie-level test development. For example: characterization of polarization splitter-rotators and characterization of component backreflection. Probe card qualificationYield learning and spatial analysisTest time optimizationFoundry engagement and factory transfer

Preferred:

• Experience with high-speed optical and electrical testing of photonic integrated circuits or optical transceivers.
• Experience specifically with silicon photonics PICs, testing over a broad wavelength range.
• Experience influencing PIC DFT and collaborating closely with PDK development teams.
• Strong background in high-volume semiconductor or photonics manufacturing ecosystems.
• Demonstrated leadership in scaling test infrastructure across multiple nodes and product families.