Senior Power Electronics Engineer

Key Responsibilities

• Architectural design and detailed schematic implementation of advanced, bi-directional, isolated and non-isolated converter topologies (e.g., DAB, resonant topologies, multi-level converters MMCs, and multi-stage SSTs).
• Partner with mechanical and manufacturing engineers to integrate high-power converter modules and stacks with thermal management systems, racking, structural support, and system-level cabinet into manufacturable designs.
• Design layouts to minimize the critical effects of circuit parasitics - e.g. loop inductance, and gate loop parasitics, to manage voltage overshoot, ringing, and electromagnetic interference (EMI).
• Design custom, high-frequency, magnetic components, balancing core losses, skin/proximity copper losses, and thermal dissipation.
• Partner closely with embedded controls and firmware engineers to implement digital control algorithms.
• Lead hands-on bring-up, testing, debugging, and iterative hardware revisions of high-power modules, validating physical electrical circuit and thermal behavior against theoretical models.
• Implementation of state-of-the-art DFX practices throughout the hardware design cycle, including Design for Manufacturability (DFM), Design for Assembly (DFA), Design for Testability (DFT), and Design for Cost (DFC) to enable seamless, high-yield mass production.
• Collaborate closely with NPI and manufacturing engineers to establish robust production assembly flows, end-of-line functional testing configurations, and second-sourcing strategies for critical path components.

Skills & Requirements

• Education / Experience
  • MS or PhD degree with specialization in power electronics, plus industry experience (5+ years with MS and 3+ years with PhD) in developing high-power, high-voltage converters (kW to multi-MW scale).
  • A proven, referenceable track record of taking at least one complex, high-power electronics hardware product from early concept entirely through prototyping, regulatory certifications, and hand-off to sustained high-volume mass production.
  • Expertise in modern Design for Excellence (DFX) principles. Demonstrated capability in identifying manufacturing bottlenecks, reducing Cost of Goods Sold (COGS), and improving product yield rates without sacrificing performance.
  • Proven track record of taking complex, high-power grid-tied converters from initial topology selection and multi-physics modeling through to a certified, physical commercial product.
  • Deep understanding of power semiconductor switching physics, device capacitance dynamics, wide bandgap semiconductors, safe operating area and thermal constraints.
  • Expertise in identifying and mitigating parasitic layout, shielding methods, and high-frequency noise coupling paths in multi-layer PCBs, copper busbars, and power modules.
  • Familiarity with converter control, digital signal processing (DSP), and grid-connected inverter control methodologies (grid-following and grid-forming).
  • Exceptional skill in utilizing oscilloscopes, differential probes, Rogowski coils, network analyzers, and power analyzers for dynamic signal characterization and switching loss extraction.
  • Proficiency in schematic capture, multi-physics thermal/magnetic simulation, and circuit simulators (e.g., PLECS, SPICE, LTspice, Simulink).
• Specific Skills / Abilities
  • Familiarity with modern PLM (Product Lifecycle Management) structures and enterprise PLM/CAD ecosystems (e.g., Dassault Systèmes / 3DEXPERIENCE / DSX environments) to manage bills of materials (BOMs), engineering change orders (ECOs), and multi-site production handoffs.
  • Experience with medium-voltage (MV) systems and converters (e.g., 13-kV and 35-kV classes), including advanced insulation coordination, clearance/creepage design, and partial discharge mitigation.
  • Experience with utility-scale grid-tied systems, including switchgear, circuit breakers, and protective relays.
  • Familiarity with heavy industrial packaging technologies, structural busbars, specialized encapsulation potting, conformal coating, and liquid cooling architectures.
  • Familiarity with evolving international power converter and grid codes (e.g., UL, IEEE, IEC, etc.).