Jobs · Engineering · Texas

Senior Hardware Architect

Molex · Austin, TX · Today
On-siteEngineering$140k–$225k/yrFull-time

About the role

We are seeking a highly skilled and experienced Senior Hardware Architect to develop cutting-edge next-generation hardware systems tailored for high-performance computing (HPC) and artificial intelligence (AI) workloads. This role demands deep expertise in electrical and mechanical systems, system-level architecture, and high-speed interconnects.

At Molex, we create connections for life by enabling technologies that transform the future and improve lives. With presence in more than 40 countries, we offer a complete range of connectivity products, services, and solutions across various industries, including data communications, medical, industrial, automotive, and consumer electronics. Our Datacom and Specialty Solutions (DSS) team specializes in providing interconnect solutions essential for building reliable communications equipment, catering to telecommunications, datacom, hyperscalers, cloud, data center, and storage applications. We continue to innovate to meet the demands of next-generation markets.

The position is a key role in the Molex CTO office that helps enable better long-term technical decisions by ensuring that individual technologies across engineering disciplines are evaluated within the context of data center architectures and in the industry at-large.

As a Koch company, Molex is a leading supplier of connectors and interconnect components, driving innovation in electronics and supporting industries from automotive to health care and consumer to data communications. Our experienced people, groundbreaking products, and leading-edge technologies help us deliver a wider array of solutions to more markets than ever before.

Responsibilities

Hardware Architecture & Design

  • Provide thought leadership in designing scalable, reliable, and high-performance hardware architectures.
  • Working with the System Architect, define system-level requirements across electrical, thermal, and mechanical domains and translate them into robust reference designs.
  • Collaborate cross-functionally with electrical, thermal, and mechanical teams to ensure seamless technology integrations.
  • Architect systems optimized for AI and HPC environments that target GPU, TPU, IPU, and other accelerator-based platforms.
  • Drive innovation that balances power delivery, signal integrity, and thermal solutions to meet demanding performance targets.

Technical Leadership & Mentorship

  • Serve as a subject matter expert in SerDes performance, retimer/redriver technologies, and complex hardware systems.
  • Participate in design reviews and promote best practices across engineering teams.
  • Maintain current understanding of emerging technologies, tools, and methodologies to enhance system performance.
  • Identify bottlenecks and propose optimizations based on industry experience and benchmarking.

What You Can Expect

  • Technical ownership of future connectivity architectures.
  • Collaboration with silicon partners and internal product teams.
  • Access to advanced simulation, measurement, and prototyping capabilities.
  • Opportunities to evaluate early-stage technologies and influence product decisions.
  • Broad visibility across the CTO organization, engineering teams, and business units.

Requirements

  • Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field.
  • 10+ years of experience in hardware design and architecture for high-performance systems.
  • Deep expertise in power delivery, signal integrity, and thermal management.
  • Strong collaboration and communication skills across multidisciplinary teams.
  • Strong analytical and troubleshooting skills for complex multi-domain issues.
  • Familiarity with advanced packaging technologies.
  • Hands-on experience with switch ICs and AI accelerators (GPU, TPU, IPU).
  • Experience designing and scaling hardware for AI inference and training workloads.

Preferred Qualifications

  • Proficiency in PCB layout, CAD tools, and electromagnetic simulation (e.g., HFSS).
  • Proven experience with SerDes, retimers, and linear amplifiers.

Pay

For this role, we anticipate paying $140,000 - $225,000 per year. This role is eligible for variable pay, issued as a monetary bonus or in another form. Any compensation range provided is an estimate determined by available market data; the actual amount may be higher or lower considering each candidate's knowledge, skills, abilities, and geographic location.

Benefits

Our goal is for each employee, and their families, to live fulfilling and healthy lives. We provide essential resources and support to build and maintain physical, financial, and emotional strength — focusing on overall wellbeing. Our benefits plan includes:

  • Medical, dental, and vision coverage
  • Flexible spending and health savings accounts
  • Life insurance, accidental death & dismemberment (ADD), and disability coverage
  • Retirement plans
  • Paid vacation/time off

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