Senior Engineer II-Contract Manufacturing Operations

About the role

This position will have a strong operations ownership to lead performance, reliability, and continuous improvement across US-based contract manufacturing partners supporting high-technology electronics products.

Responsibilities

• Own operational performance of contract manufacturers, ensuring production plans, cycle times, yields, and on-time delivery meet business targets.
• Serve as the senior technical/operations interface to contract manufacturers for escalations, root-cause investigations, and corrective/preventive actions (8D/CAPA).
• Lead manufacturing process engineering for PCBA (SMT and thru-hole) and system/box build, driving process controls, work instructions, test strategy alignment, and standardization.
• Analyze manufacturing KPIs (yield, scrap, rework, throughput, OTD, downtime) and implement data-driven improvements using SPC, DOE, and statistical analysis.
• Drive cost and productivity initiatives (labor efficiency, line balancing, takt/capacity optimization, waste reduction, EOQ/JIT/Kanban), including validation of savings.
• Plan and execute NPI and production scale-up with CMs: DFM/DFT feedback, process readiness, pilot builds, build reviews, and smooth handoff to volume.
• Facilitate Quarterly Business Reviews (QBRs), developing performance dashboards, risk assessments, and action plans with clear owners and timelines.
• Partner with Supplier Operations/Procurement to support Manufacturing Services Agreement (MSA) scope discussions, operational requirements, and performance expectations.
• Cook up cross-functionally to resolve supply/production constraints quickly and minimize customer impact; lead structured problem solving and containment.
• Ensure adherence to quality systems and measurement integrity (FMEA, control plans, Gage R&R, correlation studies), and support supplier quality alignment.

Requirements/Qualifications

• Bachelor’s degree in Industrial/Manufacturing/Mechanical/Electrical/Electronics Engineering (or related); strong technical background required.
• 7.5-10 years in high-technology manufacturing with significant experience in contract manufacturing operations and electronics production.
• Deep knowledge of PCBA manufacturing (SMT, thru-hole), system integration/box build, and process engineering fundamentals.
• Working knowledge of test engineering, component engineering, planning, and supplier quality practices preferred.
• Proficiency with Lean/Six Sigma tools and methodologies: DOE, SPC, FMEA, Gage R&R, data correlation/analysis, Kanban/JIT, waste reduction, EOQ.
• Strong capability with ERP/manufacturing systems and analytics/reporting tools to drive decisions and track results.
• Demonstrated leadership influencing across organizations; strong communication, negotiation, and stakeholder management skills.
• Willingness to travel domestically to supplier/CM sites as needed.
• Requirement for home “base” to be at a primary CM to support BU.

Physical Attributes

• Hearing, Seeing, Talking, Works Alone, Works Around Others
• Physical Requirements: 80% sitting, 10% standing, 10% walking

Pay Range

The annual base salary range for this position, which could be performed in the US, is $70,304-$205,000.* Range is dependent on numerous factors including job location, skills and experience.

Benefits

Find more information about all our benefits at the link below: Benefits of working at Microchip

Microchip Technology Inc is an equal opportunity/affirmative action employer.