Senior Engineer I, System Engineering (Systems and Mechanical Engineering – Electrostatic Chuck (ESC))

Key Responsibilities

• Select and qualify dielectric materials (alumina, AlN, Y2O3) for ESC ceramic layers based on electrical, thermal, and chemical compatibility requirements.
• Define ESC clamping voltage, leakage current, and chucking/dechucking performance specifications.
• Characterize ESC electrical properties including volume resistivity, dielectric constant, and breakdown voltage across process temperature ranges.
• Analyze and mitigate wafer backside contamination, particle generation, and arcing risks associated with ESC operation.
• Support ESC integration with RF bias and DC chucking power supplies in plasma processing chambers.
• Design multi-zone embedded heater assemblies for uniform wafer temperature distribution across process temperatures (room temperature to 700°C+).
• Perform thermal modeling and simulation (FEA) to optimize heater layout, power density, and zone configuration.
• Develop and validate closed-loop temperature control systems including thermocouple/RTD sensor selection and PID control tuning.
• Characterize heater uniformity, ramp rates, and thermal response using wafer-level temperature mapping tools.
• Manage thermal stress and CTE mismatch between heater, ceramic, and base plate materials to ensure long-term reliability.

Required Qualifications

• Master's degree or PhD in Materials Science, Ceramic Engineering, or related discipline.
• 3–5 years of experience in semiconductor capital equipment engineering, with direct exposure to ESC or heater technologies.
• Experience with 300mm wafer processing tools and OEM component qualification processes.
• Knowledge of high-purity ceramic fabrication techniques (sintering, plasma spray, anodization).
• Familiarity with reactive process chemistries (fluorine, chlorine plasmas) and their impact on ESC/heater materials.
• Solid understanding of electrostatic clamping mechanisms (Coulombic and JR force models) and their process dependencies.
• Experience with ceramic materials and thin-film dielectric systems used in semiconductor equipment.
• Familiarity with thermal management in vacuum environments, including radiation, conduction, and convection heat transfer.
• Hands-on experience with electrical characterization equipment (LCR meters, high-voltage testers, curve tracers).
• Knowledge of plasma processing systems (etch, CVD, PVD, or ALD) and their requirements for ESC performance.
• Experience with FEA thermal simulation tools (ANSYS, COMSOL, or equivalent).
• Strong analytical and problem-solving ability with a systematic approach to failure analysis.
• Effective communication skills and ability to work in cross-functional teams.