Senior Engineer

Responsibilities

• Maintain deep expertise in at least two electronic assembly processes, including but not limited to: Wave soldering, Selective soldering, Conformal coating, PCB panel singulation, SMT solder printing, SMT pick-and-place, SMT reflow, AOI, equipment maintenance & troubleshooting
• Develop and deploy global electronic assembly process standards
• Reduce cost, improve quality, and increase throughput
• Author and maintain procedures, work instructions, and training materials
• Drive compliance to best-practice standardization across global facilities
• Lead equipment selection, justification, purchase, and implementation
• Manage capital projects from requirement definition through production release
• Benchmark emerging electronic assembly technologies via suppliers, industry conferences, and technical forums
• Afford assessment of global electronic assembly manufacturing facilities against standardized criteria
• Data-driven process optimization
• Use DOE, control charts, and statistical analysis
• Monitor and report electronic assembly KPIs to drive continuous improvement
• Apply Lean Six Sigma methodologies (DMAIC and DMADV)
• Cross-functional & design engagement
• Partner with design teams on DFM / DFA
• Integrate assembly considerations into Electronic Assembly Design Guidelines
• Share knowledge through presentations, documentation, and technical reviews

Qualifications

• Typically requires a minimum of 5 years of related experience
• Bachelor's Degree in Engineering (Mechanical, Electrical, or Industrial preferred)
• 2–5+ years hands-on electronic assembly manufacturing experience
• Depth in solder profiling, SMT, post-SMT or conformal coat processes
• IPC-A-610 familiarity
• Leverage Lean Six Sigma experience (Green Belt+ preferred)