Senior Electronic Repair Engineer

About the role

This role serves as the organization's technical authority for component-level electronics repair, reverse engineering, failure analysis, and repair methodology development.

Responsibilities

• Diagnose, troubleshoot, and repair complex multilayer PCB assemblies to the component level utilizing advanced engineering diagnostic techniques.
• Perform precision surface mount rework, BGA/FPGA replacement, thermal profile development, and advanced PCB restoration including trace, pad, via, and multilayer interconnect reconstruction.
• Reverse engineer electronic assemblies and develop validated repair methodologies, engineering work instructions, electrical test procedures, and technical documentation where OEM documentation is unavailable.
• Execute precision rework of fine-pitch surface-mount components, including QFP, QFN, CSP, BGA, and FPGA devices, utilizing advanced rework systems such as the Ersa HR600 XL and Ersa IR/PL650A.
• Remove, reball, replace, and functionally verify FPGA and BGA devices while developing and optimizing thermal profiles for complex multilayer PCB assemblies.
• Collaborate with Quality, Operations, Technical Support, Supply Chain, and Field Service to develop new repair capabilities and improve engineering processes.
• Ensure compliance with ISO 13485 Quality Management System requirements, ESD standards, and established engineering documentation practices.
• Evaluate emerging repair technologies, equipment, and engineering techniques that expand the organization's advanced electronics repair capabilities.

Requirements

• High School Diploma/GED, or equivalent from two-year university or technical school; or a minimum of 8 years of related experience to the work activities or equivalent combination of education and experience.
• Exceptional analytical, troubleshooting, and engineering problem-solving abilities with the technical judgment to independently resolve highly complex electronic failures.
• Meticulous attention to detail and an uncompromising commitment to quality, reliability, and engineering excellence.
• Excellent technical communication and documentation skills with the ability to effectively communicate complex engineering concepts across cross-functional teams.
• Demonstrated innovation and creativity in developing new repair methodologies, solving unsupported electronic failures, and driving continuous improvement.
• Strong technical leadership with the ability to mentor engineers and technicians while serving as a trusted subject matter expert in advanced electronics repair.

Qualifications

• Working knowledge of IPC-7095 – Design and Assembly Process Implementation for Ball Grid Arrays (BGAs), including BGA assembly, inspection, thermal profiling, re-balling, and advanced FPGA/BGA rework best practices.
• IPC-A-610 – Acceptability of Electronic Assemblies.
• IPC J-STD-001 – Requirements for Soldered Electrical and Electronic Assemblies.
• IPC-7711/7721 – Rework, Repair and Modification of Electronic Assemblies.
• ANSI/ESD S20.20 Electrostatic Discharge Control.

Skills

• Advanced component-level repair of complex multilayer printed circuit board assemblies (PCBAs).
• Diagnosing and repairing high-density analog, digital, mixed-signal, RF, embedded, and power electronic assemblies utilizing advanced troubleshooting, BGA/FPGA rework, multilayer PCB restoration, reverse engineering, and engineering-level failure analysis.
• Supporting diagnostic medical imaging, aerospace, defense, semiconductor manufacturing equipment, industrial automation, or other high-reliability electronic systems.

Benefits

• No benefits specified.

Pay

• No pay specified.

Schedule

• No schedule specified.