Jobs · Quality Assurance · Ohio

Semiconductor Device Engineer

KBR Careers · Beavercreek Township, OH · 1 wk ago
Quality AssuranceFull-time

About the Role

KBR's National Security Solutions team provides high-end engineering and advanced technology solutions to customers in the intelligence and national security communities. We are seeking a highly motivated and hands-on Semiconductor Device Engineer to join our team researching Ga-polar and N-polar Gallium Nitride devices. This entry-level role (0-2 years of experience) is designed for an engineer with a strong foundation in semiconductor physics and a desire to work directly in a cleanroom environment. In this role, you will bridge the gap between virtual modeling and physical realization by performing TCAD simulations, fabricating test structures in our state-of-the-art cleanroom, conducting DC/RF electrical testing, and inspecting devices using advanced microscopy. You will work closely with senior engineers to accelerate technology development and optimize device performance.

Key Responsibilities

  • Cleanroom Fabrication & Process Support: Spend active time in the cleanroom environment assisting with process steps, managing test runs, and operating fabrication equipment (e.g., photolithography, wet/dry etching, thin-film deposition).
  • Device Simulation (TCAD): Utilize TCAD simulation tools (e.g., Synopsys Sentaurus, Silvaco) under the guidance of senior engineers to model basic device physics, predict electrical behaviors, and guide physical experiments.
  • Electrical Characterization (DC & RF): Set up and execute parametric electrical testing. Perform DC measurements (I-V, C-V) and RF/high-frequency measurements (S-parameters) using manual or semi-automated probe stations, parameter analyzers, and network analyzers.
  • Microscopy & Metrology: Conduct physical characterization and failure analysis on fabricated devices using advanced microscopy tools, including Scanning Electron Microscopy (SEM), Atomic Force Microscopy (AFM), and optical microscopes.
  • Data Analysis & Reporting: Compile, analyze, and present experimental data. Compare electrical measurements against TCAD simulation results to identify discrepancies and suggest device improvements.
  • Documentation & Safety Compliance: Maintain rigorous documentation of cleanroom runs, testing protocols, and safety procedures.

Work Environment

  • Location: On-Site
  • Travel Requirements: Minimal 0-20%
  • Working Hours: Standard

Required Qualifications

  • Education: Bachelor's degree in Electrical Engineering, Materials Science, Physics, Nanoengineering, or a closely related engineering field.
  • Experience: 0 to 2 years of hands-on cleanroom experience (can include undergraduate research, senior capstone design projects, or internships).
  • Fabrication Skills: Familiarity with standard cleanroom protocols, safety standards, and basic microfabrication processing techniques.
  • Testing & Metrology: Basic experience with semiconductor parametric testing equipment (e.g., source measure units, lock-in amplifiers). Hands-on experience or coursework exposure to DC/RF electrical characterization concepts. Direct experience operating optical microscopes; exposure to SEM or AFM is highly desirable.
  • Simulation & Software: Exposure to TCAD simulation software (e.g., Sentaurus, Silvaco, or COMSOL) through coursework or academic projects.
  • Communication & Teamwork: Strong written and verbal communication skills, with an eagerness to learn from senior mentors and collaborate in a fast-paced laboratory setting.
  • Security Clearance: Must possess the ability to obtain and maintain a U.S. Government clearance. Public Trust clearance required.

Desired Qualifications

  • Hands-on experience with Ga-polar and N-polar Gallium Nitride device modeling and fabrication.
  • Experience using scripting languages (such as Python or MATLAB) to automate data extraction, instrumentation control, or analyze large testing datasets.
  • Prior internship in a semiconductor lab or an academic cleanroom facility.
  • Familiarity with calibration techniques for RF testing.
  • Experience interpreting cross-sectional SEM images and surface topography profiles from AFM.

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