Research Scientist, Multiscale Modeling Summer 2027 Intern

Internship Details

Summer 2027 Internship. Duration: Monday, May 17 – August 20, 2027. Location: Austin, TX.

What You Can Expect

• Meaningful project work: each intern is assigned a project that delivers value to the business.
• Lean thinking: interns apply Lean principles and continuous improvement; Lean training and resources are provided.

Position Summary

Tokyo Electron America, Inc., a subsidiary of Tokyo Electron Limited, seeks a summer intern with expertise in multiphysics modeling, transport phenomena, and computational simulation to work in the Surface Preparation System (SPS) Advanced Technology Group (ATG) in Austin, Texas. The intern will support development of a novel multiscale modeling framework for semiconductor wet processing, linking wafer‑scale transport phenomena and nanoscale feature etching behavior.

Responsibilities

• Develop physics‑based models describing transport and reaction phenomena in wet chemical semiconductor processing.
• Build multiscale simulation frameworks linking wafer‑scale flow, species transport, and thermal behavior to nanoscale feature etching dynamics.
• Analyze simulation and experimental data to validate model predictions across process parameters such as wafer spin speed, chemical composition, dispense conditions, and temperature.
• Support development of advanced simulation methodologies for process optimization, technology development, and digital‑twin implementation.
• Collaborate on global projects with TEL U.S. R&D sites, manufacturing divisions, semiconductor customers, consortia, vendors, and academic partners.
• Demonstrate strong problem‑solving skills, structured project management, and effective teamwork within multidisciplinary groups.

Qualifications

• B.S. degree or higher (pursuing M.S. or Ph.D. preferred) in Engineering, Applied Mathematics, Physics, Computational Engineering, Materials Science, or related fields.
• Strong understanding of transport phenomena including fluid dynamics, mass transfer, diffusion, convection‑diffusion‑reaction systems, and surface reaction kinetics.
• Knowledge of multiscale modeling methodologies and reduced‑order modeling techniques (desirable).
• Familiarity with macro transport theory, homogenization methods, or other scale‑bridging approaches (desirable).
• Experience modeling transport in confined geometries, porous media, microfluidics, or high‑aspect‑ratio structures (desirable).
• Experience with programming languages such as Python, MATLAB, C/C++, or Julia (desirable).
• Experience with data‑driven modeling, machine learning, or surrogate modeling approaches (a plus).
• Relevant semiconductor manufacturing experience or knowledge of wet etching, wet cleaning, deposition, or advanced process technologies (preferred).
• Experience working in a global and multicultural environment (preferred).
• Excellent written and oral communication skills, with ability to explain complex technical concepts to diverse technical audiences.