Program Management Intern - SiC Power Modules

Key Responsibilities And Duties

• Lead and support NPI program management activities for SiC high-power module development programs targeting AI and electrification end markets.
• Own and maintain detailed program schedules, milestone trackers, and risk registers to ensure programs launch on time and within technical specifications.
• Cook up and communicate with suppliers, manufacturing partners, and internal stakeholders to align on program requirements and deliverables.
• Execute and refine the NPI process gate reviews — including design reviews, qualification milestones, and product release criteria.
• Collaborate cross-functionally with R&D, applications engineering, operations, and quality teams to track action items and resolve program blockers.
• Prepare executive program status reports, dashboards, and presentations for senior leadership review.
• Support supplier development activities including monitoring qualification progress, tracking sample deliveries, and facilitating corrective action plans.

Qualifications

• Minimum Qualifications: BS in Electrical Engineering (required); currently enrolled in or accepted to a graduate-level MS or PhD program in Electrical Engineering, Power Electronics, or closely related discipline.
• Ability to communicate clearly with the internal team and external suppliers abroad. Professional, articulate speaking skills required.
• Foundational knowledge of semiconductor device physics, power electronics, or semiconductor manufacturing processes.
• Strong organizational and communication skills with demonstrated ability to manage multiple concurrent tasks and deadlines.
• Proficiency in Microsoft Office Suite (Excel, PowerPoint, Project) and/or project management tools (e.g., Asana, Jira, Smartsheet).
• Expert at using AI tools to assist in automating tasks and ideation (Copilot, Claude, PowerAutomate, PowerBI are preferred).
• Preferred Qualifications: Prior internship, co-op, or research experience within the semiconductor, power electronics, or hardware product development industry.
• Familiarity with Silicon Carbide (SiC) or Wide Bandgap (WBG) semiconductor technologies, process flows, or device characterization.
• Exposure to NPI, stage-gate, or structured product development processes in a technology or hardware environment.
• Understanding of power module packaging concepts (e.g., substrate types, thermal management, module assembly) for high-power applications.
• Experience working in cross-functional or cross-cultural teams; prior exposure to Asia-Pacific supplier ecosystems is a plus.
• Coursework or research in AI hardware, power conversion systems, or electrification platforms (EV, data center, renewable energy).