Product Development / Thermal Engineer - Liquid Cooling

Position Overview

Amphenol High Speed Products Group is the market leader for high speed, high bandwidth electrical connectors for the Telecom/Datacom market (Mobile Networks, Storage, Servers, Routers, Switches, etc.). Our products help to enable the electronics revolution and remain a key enabler for all the major Tier 1 OEMs globally. We are currently seeking a Product Development Engineer - Liquid Cooling to join our team.

Key Responsibilities

• Design & Development Architect and develop liquid cooling plates optimized for high-density front-end I/O connector applications.
• Engineer microchannel structures, cold plate geometries, and flow path configurations to maximize thermal efficiency and minimize pressure drop.
• Select and integrate materials compatible with high-performance thermal transfer and long-term reliability in data center environments.
• Collaborate with connector design teams to ensure seamless mechanical integration and manufacturability.
• Testing & Validation
• Define and execute thermal performance testing, including heat dissipation, flow rate analysis, and environmental stress testing.
• Validate cooling plate designs against industry standards and customer-specific requirements.
• Work with internal labs and external partners to ensure robust qualification and certification processes.
• Project Management
• Lead cross-functional development projects from concept through production.
• Manage timelines, deliverables, and resource coordination to meet program milestones.
• Track and report progress using structured project management tools and methodologies.
• Customer Engagement
• Serve as a technical liaison with key customers to understand requirements and deliver exceptional support.
• Represent Amphenol's commitment to exceptional customer experience through proactive communication, technical presentations, and issue resolution.

Qualifications

• Bachelor's or Master's degree in Mechanical Engineering, Thermal Engineering, or related field.
• 4+ years of work experience in product development, preferably in thermal management or connector technologies.
• Minimum 3 years of work experience with Liquid Cooling and CFD is required (MUST HAVE).
• Strong proficiency in CAD tools (e.g., SolidWorks, Creo) and thermal simulation software (e.g., ANSYS, FloTHERM).
• Proven experience in project management and cross-functional collaboration.
• Excellent communication skills and customer-facing experience.

Preferred Skills

• Familiarity with high-speed I/O connector standards and applications.
• Experience in AI/ML hardware environments or data center infrastructure.
• Knowledge of fluid dynamics, heat exchanger design, and materials used in liquid cooling systems.