Product Development Engineer (28nm)

Responsibilities

• Conduct thorough analysis of production yield issues to identify root causes and implement corrective actions that enhance product performance and manufacturing efficiency.
• Collaborate with Business Units to characterize, qualify, and successfully release new products to production, ensuring a smooth transition from design to manufacturing.
• Address daily production challenges including low yield disposition and process troubleshooting.
• Lead initiatives focused on productivity, cost reduction, and quality enhancement across the production process.
• Utilize statistical tools and production data to guide engineering decisions and process improvements.
• Work with design teams on product simulation, design verification and silicon debug.
• Liaise with business units' product engineering teams to drive yield improvements through test program optimization, hardware enhancements, and setup adjustments.

Qualifications

• Minimum requirements: Experience with 28nm (or similar) technologies, Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field, 5+ years of experience in semiconductor manufacturing, test engineering, failure analysis, or related areas, Strong technical background in semiconductor devices, testing, or failure analysis principles, Experience analyzing production test data and diagnostic results to investigate device failures, Proficiency in tools such as JMP, Excel, and statistical analysis software, Excellent communication and collaboration skills, Ability to work independently and in cross-functional teams.
• Preferred Qualifications: Master’s degree in Electrical Engineering, Computer Engineering, Computer Science, or related field, 10+ years of experience in semiconductor manufacturing, testing, failure analysis, or yield engineering, Experience with memory mapping tools, ATPG diagnostics with Cadence Modus or Synopsys Tetramax , and Avalon layout database environments, Experience using electrical failure analysis techniques such as photon emission analysis, laser-assisted fault isolation, waveform acquisition, or similar FA instrumentation, Experience analyzing wafer-level yield or semiconductor process development issues, Expertise in analog/mixed-signal circuit design, analysis, and verification, including experience with Operational Amplifiers (OP Amps), Analog-to-Digital Converters (ADCs), Digital-to-Analog Converters (DACs), and Radio Frequency (RF) circuits, Knowledge of memory design and architecture, including Static Random-Access Memory (SRAM) and Flash memory, In-depth knowledge of semiconductor manufacturing processes, including fabrication, assembly, and test, Proven ability to drive results, prioritize tasks, and manage time to meet project deadlines, Adaptability and resilience in a fast-paced, dynamic environment with multiple priorities and interruptions, Strong interpersonal and influencing skills, with ability to build effective relationships and communicate with diverse stakeholders, Exceptional problem-solving skills, with attention to detail and ability to think creatively, Strategic thinking and ability to navigate complex, high-pressure situations with poise and professionalism.