Process Engineer II
We anticipate the application window for this opening will close on 30 Aug 2026.
About the role
The Process Engineer II will develop and transfer highly stable, cost-effective, and scalable microelectronic packaging assembly (Printed Circuit Board Assembly and Wafer Level Packaging and Test) processes into manufacturing. Responsibilities include output monitoring, conducting experiments to establish robust processes, understanding process interactions, defining equipment needs, establishing design rules, metrologies, process controls, and developing a high-volume production strategy.
Responsibilities
- Scouting and feasibility work, material selection, process and equipment selection, tooling/fixture and equipment installation, and assessment of inputs, outputs, and alignment to requirements.
- Develops manufacturing processes applicable to statistical process control, including measurement systems.
- Performs equipment qualifications (IQ), process validations (Process characterization, OQ, and PQ), and gage R&R studies (TMV).
- Applies statistical methods and science-based decisions to design experiments and implement improvements.
- Performs experiments to establish robust processes, monitors, root causes, and resolves process yield issues.
- Provides technical and sustaining engineering support in a manufacturing area; troubleshoots and resolves equipment/process production issues.
- Generates and maintains documentation per quality system regulations.
- Ensures processes and procedures comply with regulations.
Requirements
- Bachelor’s degree required with 2+ years of relevant experience OR Master’s degree with 0+ years of relevant experience.
- For Baccalaureate degrees earned outside the United States, a degree that satisfies the requirements of 8 C.F.R. 214.2(h)(4)(iii)(A) is required.
Skills
- Experience in microelectronics packaging processes including pick and place, solder print, underfill, reflow, clean, singulation processes, automated inspections, etc.
- Experience in developing a process from concept to transfer in manufacturing and/or experience working in a high-volume facility.
- Experience with DRM/DFSS, Lean Sigma, or Green/Black Belt Lean Sigma certification.
- Knowledge of DOE, statistical analysis methods, and data analysis tools (Minitab, JMP, etc.).
- Experience and understanding of SPC principles including process capability analysis and control charts.
- Experience or aptitude to program, run, and troubleshoot automated equipment, machine vision, and automated metrology tools.
- Prefers hands-on engagement with equipment/process and running the tool.
Schedule
In-person exchanges are invaluable to our work. We’re working onsite 4 days a week as part of our commitment to fostering a culture of professional growth and cross-functional collaboration.
Benefits
The following benefits and additional compensation are available to regular employees who work 20+ hours per week:
- Health, Dental, and Vision insurance
- Health Savings Account
- Healthcare Flexible Spending Account
- Life insurance
- Long-term disability leave
- Dependent daycare spending account
- Tuition assistance/reimbursement
- Simple Steps (global well-being program)
- Incentive plans (Medtronic Incentive Plan - MIP)
- 401(k) plan plus employer contribution and match
- Short-term disability
- Paid time off and holidays
- Employee Stock Purchase Plan
- Employee Assistance Program
- Non-qualified Retirement Plan Supplement (subject to IRS earning minimums)
- Capital Accumulation Plan (available to Vice Presidents and above, or subject to IRS earning minimums)
Note: Some benefits may not apply to workers in Puerto Rico.
Pay
Salary ranges for U.S. (excluding PR) locations: $84,000.00 - $126,000.00. The offered rate complies with federal and local regulations and may vary based on factors such as experience, certification/education, market conditions, and location.