Principal Systems Architect – Automotive Networking Ecosystem

About the role

Your job is to shape automotive networking architectures years before production vehicles reach the road. You will engage semiconductor companies, OEM technology leaders, Tier 1 suppliers, and industry standards organizations to influence the future of Automotive Ethernet, high-speed connectivity, zonal architectures, and software-defined vehicles.

Responsibilities

• Serve as Molex's primary signal integrity authority for automotive high-speed channels including channel modeling, insertion loss, return loss, crosstalk (NEXT/FEXT), eye diagram analysis, and loss budget definition at the connector/PCB/PHY interface.
• Evaluate SI tradeoffs across Automotive Ethernet variants (100BASE-T1, 1000BASE-T1, Multi-Gig Ethernet) and emerging high-speed protocols to guide product design decisions.
• Provide technical guidance on PCB stack-up, trace routing, impedance control, and EMC/EMI considerations as they relate to connector and cable assembly integration.
• Engage directly with PHY engineers and system architects at chipmakers and OEMs to validate SI performance requirements and drive Molex solutions into reference designs.
• Build and sustain strategic relationships with leading semiconductor companies, including NXP, Texas Instruments, Analog Devices, Microchip, Infineon, Broadcom, Marvell, and others to influence PHY and chipset reference designs and embed Molex connectivity solutions early in the architecture definition phase.
• Develop and execute a strategic ecosystem roadmap that aligns chipmakers, standards bodies, and OEMs to accelerate technology adoption and Molex portfolio positioning.
• Monitor and communicate semiconductor roadmaps, standards activity, and technology trends to internal product, engineering, and business development stakeholders.
• Engage OEM architecture teams in pre-competitive, concept-phase discussions to understand long-term platform requirements, architectural bottlenecks, and connectivity needs.
• Translate OEM and ecosystem intelligence into clear identification of gaps in Molex's product portfolio and partner with Product Management and Engineering to build the roadmap to close them.
• Collaborate with Tier 1 suppliers and module designers to influence future networking architectures and establish Molex as the preferred connectivity solution early in the design cycle.
• Participate actively in industry standards organizations including IEEE, OPEN Alliance, etc. and related consortiums shaping technical specifications that define next-generation vehicle architectures.
• Represent Molex at industry conferences, standards meetings, customer workshops, and technical forums as a recognized subject matter expert.
• Drive technical thought leadership through standards participation, conference presentations, publications, and industry leadership activities that strengthen Molex's position and reputation.

Requirements

• Bachelor's or Master's degree in Electrical Engineering, Systems Engineering, Computer Engineering, or a related technical field.
• Deep, hands-on expertise in signal integrity for automotive or high-speed communication applications including channel modeling, loss budget analysis, eye diagram evaluation, and PHY/connector interface characterization.
• Strong knowledge of Automotive Ethernet (100BASE-T1, 1000BASE-T1, Multi-Gig Ethernet), high-speed communication protocols, and semiconductor/PHY ecosystems.
• Experience engaging with semiconductor companies, OEMs, Tier 1 suppliers, and industry stakeholders at a technical level.
• Proven ability to build strategic relationships, influence technical and business audiences, and translate market insights into product and technology strategy.
• Experience in systems architecture, product strategy, technical business development, or technical program leadership within the automotive, semiconductor, or connectivity industries.

Qualifications

• Familiarity with PCB stack-up, impedance control, trace routing, and layer design as it relates to high-speed connector and cable integration.
• Active participation in IEEE, OPEN Alliance, MIPI, PCI-SIG, or related industry standards organizations.
• Hands-on experience with semiconductor companies such as NXP, Texas Instruments, Analog Devices, Microchip, Infineon, Broadcom, or Marvell particularly in PHY or chipset ecosystem engagement.
• Experience influencing OEM zonal architecture decisions, software-defined vehicle platforms, or early-stage technology development programs.
• Demonstrated technical thought leadership through conference presentations, standards contributions, technical publications, or recognized industry leadership.
• Experience with SerDes architectures, PHY technologies, or EMC/EMI design considerations at the system level.

Skills

• Signal Integrity Analysis
• High-Speed Communication Protocols
• Strategic Relationship Building
• Technical Business Development
• Systems Architecture
• Product Strategy
• Industry Standards Participation
• Technical Thought Leadership

Benefits

• Medical
• Dental
• Vision
• Flexible Spending and Health Savings Accounts
• Life Insurance
• Disability
• Retail
• Paid Vacation/Time Off
• Education Assistance
• Infertility Assistance
• Paid Parental Leave
• Adoption Assistance

Pay

Compensation is commensurate with experience.

Schedule

Full-time.